A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

A substrate for flexible device. The substrate has a nickel-plated metal sheet having a nickel-plating layer formed on at least one surface of a metal sheet or a nickel-based sheet, and a glass layer of an electrically-insulating layered bismuth-based glass on a surface of the nickel-plating layer or the nickel-based sheet. An oxide layer having a roughened surface is formed on the surface of the nickel-plating layer or the surface of the nickel-based sheet, and the bismuth-based glass contains 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3. Also disclosed is a method for producing the substrate for flexible device, a substrate for an organic EL device, a sheet used as a substrate for flexible device, a method for producing the sheet and a bismuth-based lead-free glass composition.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A bismuth-based lead-free glass composition containing 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3.

A bismuth-based lead-free glass composition containing 70 to 84% by weight of Bi.sub.2O.sub.3, 10 to 12% by weight of ZnO, and 6 to 12% by weight of B.sub.2O.sub.3.

A glass article contains: in mol %, more than 0% to 70% of La.sub.2O.sub.3, 0% to 80% of B.sub.2O.sub.3, 0% to 40% of SiO.sub.2, 0% to 80% of B.sub.2O.sub.3+Al.sub.2O.sub.3+SiO.sub.2, 0% to 85% of Gd.sub.2O.sub.3+Ga.sub.2O.sub.3+Y.sub.2O.sub.3+Yb.sub.2O.sub.3+ZrO.sub.2+TiO.sub.2+Nb.sub.2O.sub.5+Ta.sub.2O.sub.5+WO.sub.3, 0% to 15% of MgO+CaO+SrO+BaO, 0% to 35% of ZnO, and more than 0% to 5% of CuO.

A glass article contains: in mol %, more than 0% to 70% of La.sub.2O.sub.3, 0% to 80% of B.sub.2O.sub.3, 0% to 40% of SiO.sub.2, 0% to 80% of B.sub.2O.sub.3+Al.sub.2O.sub.3+SiO.sub.2, 0% to 85% of Gd.sub.2O.sub.3+Ga.sub.2O.sub.3+Y.sub.2O.sub.3+Yb.sub.2O.sub.3+ZrO.sub.2+TiO.sub.2+Nb.sub.2O.sub.5+Ta.sub.2O.sub.5+WO.sub.3, 0% to 15% of MgO+CaO+SrO+BaO, 0% to 35% of ZnO, and more than 0% to 5% of CuO.

A glass composition includes, as main content components, by mass %, a TeO.sub.2 content percentage of 50% to 80%, a Bi.sub.2O.sub.3 content percentage of 0% to 30%, a WO.sub.3 content percentage of 0% to 30%, a ZnO content percentage of 0% to 30%, a BaO content percentage of 0% to 30%, a GeO.sub.2 content percentage of 0% to 30%, and a Ga.sub.2O.sub.3 content percentage of 0% to 30%, wherein at least any one of additive target elements is introduced, the additive target elements including, Si.sup.4+ of 1 mg/kg to 1,500 mg/kg, B.sup.3+ of 1 mg/kg to 1,500 mg/kg, P.sup.5+ of 1 mg/kg to 1,500 mg/kg, Li.sup.+ of 1 mg/kg to 1,500 mg/kg, Na.sup.+ of 1 mg/kg to 1,500 mg/kg, K.sup.+ of 1 mg/kg to 1,500 mg/kg, Mg.sup.2+ of 1 mg/kg to 1,500 mg/kg, Ca.sup.2+ of 1 mg/kg to 1,500 mg/kg, Al.sup.3+ of 1 mg/kg to 1,500 mg/kg, and Sr.sup.2+ of 1 mg/kg to 1,500 mg/kg.

A glass composition includes, as main content components, by mass %, a TeO.sub.2 content percentage of 50% to 80%, a Bi.sub.2O.sub.3 content percentage of 0% to 30%, a WO.sub.3 content percentage of 0% to 30%, a ZnO content percentage of 0% to 30%, a BaO content percentage of 0% to 30%, a GeO.sub.2 content percentage of 0% to 30%, and a Ga.sub.2O.sub.3 content percentage of 0% to 30%, wherein at least any one of additive target elements is introduced, the additive target elements including, Si.sup.4+ of 1 mg/kg to 1,500 mg/kg, B.sup.3+ of 1 mg/kg to 1,500 mg/kg, P.sup.5+ of 1 mg/kg to 1,500 mg/kg, Li.sup.+ of 1 mg/kg to 1,500 mg/kg, Na.sup.+ of 1 mg/kg to 1,500 mg/kg, K.sup.+ of 1 mg/kg to 1,500 mg/kg, Mg.sup.2+ of 1 mg/kg to 1,500 mg/kg, Ca.sup.2+ of 1 mg/kg to 1,500 mg/kg, Al.sup.3+ of 1 mg/kg to 1,500 mg/kg, and Sr.sup.2+ of 1 mg/kg to 1,500 mg/kg.