A dental glass includes: phosphorus; sodium and/or potassium; and calcium, wherein the dental glass contains, in terms of oxide, phosphorus (P.sub.2O.sub.5) by greater than or equal to 40% by mass and less than or equal to 70% by mass, sodium and/or potassium (Na.sub.2O, K.sub.2O) by greater than or equal to 20% by mass and less than or equal to 40% by mass, and calcium (CaO) by greater than or equal to 1% by mass and less than or equal to 20% by mass, and wherein the dental glass does not substantially contain silicon and aluminum.

A glass composition includes, as expressed by mol % in terms of oxide, from 15 to 40% of PbO, from 25 to 50% of MoO.sub.3, from 5 to 25% of P.sub.2O.sub.5 and from 7 to 15% of ZnO. A glass powder includes the glass composition. The glass powder has D.sub.50 of from 0.3 to 2.0 m, where D.sub.50 is a 50% particle diameter in a volume-based cumulative particle size distribution.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag.sub.2O, V.sub.2O.sub.5 and TeO.sub.2 when the components are represented by oxides, wherein the total content ratio of Ag.sub.2O, V.sub.2O.sub.5 and TeO.sub.2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag.sub.2O, 5 to 65 mass % of V.sub.2O.sub.5, and 15 to 50 mass % of TeO.sub.2.

The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag.sub.2O, V.sub.2O.sub.5 and TeO.sub.2 when the components are represented by oxides, wherein the total content ratio of Ag.sub.2O, V.sub.2O.sub.5 and TeO.sub.2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag.sub.2O, 5 to 65 mass % of V.sub.2O.sub.5, and 15 to 50 mass % of TeO.sub.2.

An optical glass has a refractive index (n.sub.d) of 1.55 or more. A difference (Tf?Tg) between a fictive temperature (Tf) and a glass transition temperature (Tg) of the optical glass is 0? C. or more. The optical glass may have a crack initiation load L of 350 mN or more.

This invention relates to a microelectronic device comprising: a first support, a second support, first respective faces of the first support and second support being arranged opposite, and a sealing layer between said first faces, characterized in that the sealing layer comprises at least one layer of an ionic conductive material of formula Li.sub.xP.sub.yO.sub.zN.sub.w, with x strictly greater than 0 and less than or equal to 4.5, y strictly greater than 0 and less than or equal to 1, z strictly greater than 0 and less than or equal to 5.5, w greater than or equal to 0 and less than or equal to 1.

This invention relates to a microelectronic device comprising: a first support, a second support, first respective faces of the first support and second support being arranged opposite, and a sealing layer between said first faces, characterized in that the sealing layer comprises at least one layer of an ionic conductive material of formula Li.sub.xP.sub.yO.sub.zN.sub.w, with x strictly greater than 0 and less than or equal to 4.5, y strictly greater than 0 and less than or equal to 1, z strictly greater than 0 and less than or equal to 5.5, w greater than or equal to 0 and less than or equal to 1.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.