The present disclosure includes carbon-carbon composite articles having multiphase glass oxidation protection coatings for limiting thermal and/or catalytic oxidation reactions and methods for applying multiphase glass oxidation protection coatings to carbon-carbon composite articles.

The present disclosure includes carbon-carbon composite articles having multiphase glass oxidation protection coatings for limiting thermal and/or catalytic oxidation reactions and methods for applying multiphase glass oxidation protection coatings to carbon-carbon composite articles.

A method of forming a solid, dense, hermetic lithium-ion electrolyte membrane comprises combing an amorphous, glassy, or low melting temperature solid reactant with a refractory oxide reactant to form a mixture, casting the mixture to form a green body, and sintering the green body to form a solid membrane. The resulting electrolyte membranes can be incorporated into lithium-ion batteries.

A method of forming a solid, dense, hermetic lithium-ion electrolyte membrane comprises combing an amorphous, glassy, or low melting temperature solid reactant with a refractory oxide reactant to form a mixture, casting the mixture to form a green body, and sintering the green body to form a solid membrane. The resulting electrolyte membranes can be incorporated into lithium-ion batteries.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

A glass frit having a low melting point containing (A) Ag.sub.2O, (B) V.sub.2O.sub.5, and (C) at least one first oxide selected from the group consisting of MoO.sub.3, ZnO, CuO, TiO.sub.2, Bi.sub.2O.sub.3, MnO.sub.2, MgO, Nb.sub.2O.sub.5, BaO and P.sub.2O.sub.5. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (Ag.sub.2O/V.sub.2O.sub.5) of (A) to (B) of 1.8 to 3.2.

A glass frit having a low melting point containing (A) Ag.sub.2O, (B) V.sub.2O.sub.5, and (C) at least one first oxide selected from the group consisting of MoO.sub.3, ZnO, CuO, TiO.sub.2, Bi.sub.2O.sub.3, MnO.sub.2, MgO, Nb.sub.2O.sub.5, BaO and P.sub.2O.sub.5. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (Ag.sub.2O/V.sub.2O.sub.5) of (A) to (B) of 1.8 to 3.2.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.