Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).

The present invention pertains to a glass characterized by: containing 72-82% of Li.sup.+, 0-21% of Si.sup.4+, and 0-28% of B.sup.3+ in terms of cation %; and containing at least 70% and less than 100% of O.sup.2− and more than 0% and at most 30% of Cl.sup.−, containing at least 94% and less than 100% of O.sup.2− and more than 0% and at most 6% of S.sup.2−, or containing at least 64% and less than 100% of O.sup.2−, more than 0% and at most 30% of Cl.sup.−, and more than 0% and at most 6% of S.sup.2−, in terms of anion %.

The present invention pertains to a glass characterized by: containing 72-82% of Li.sup.+, 0-21% of Si.sup.4+, and 0-28% of B.sup.3+ in terms of cation %; and containing at least 70% and less than 100% of O.sup.2− and more than 0% and at most 30% of Cl.sup.−, containing at least 94% and less than 100% of O.sup.2− and more than 0% and at most 6% of S.sup.2−, or containing at least 64% and less than 100% of O.sup.2−, more than 0% and at most 30% of Cl.sup.−, and more than 0% and at most 6% of S.sup.2−, in terms of anion %.

The technology of this application relates to the field of communication technologies, and an optical fiber raw material composition, an optical fiber, and an optical fiber product. The optical fiber raw material composition includes components of the following molar percentages: AlF.sub.3 10%-50%, BaF.sub.2 3%-20%, CaF.sub.2 3%-20%, YF.sub.3 1%-15%, SrF.sub.2 3%-20%, MgF.sub.2 3%-20%, and TeO.sub.2 1%-35%. The optical fiber prepared by using the optical fiber raw material composition provided in this disclosure can be used in aspects such as a mid-infrared band transmission optical fiber, an optical fiber amplifier, a fiber laser, and an optical fiber sensor.

The technology of this application relates to the field of communication technologies, and an optical fiber raw material composition, an optical fiber, and an optical fiber product. The optical fiber raw material composition includes components of the following molar percentages: AlF.sub.3 10%-50%, BaF.sub.2 3%-20%, CaF.sub.2 3%-20%, YF.sub.3 1%-15%, SrF.sub.2 3%-20%, MgF.sub.2 3%-20%, and TeO.sub.2 1%-35%. The optical fiber prepared by using the optical fiber raw material composition provided in this disclosure can be used in aspects such as a mid-infrared band transmission optical fiber, an optical fiber amplifier, a fiber laser, and an optical fiber sensor.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.