C03C3/23

BISMUTH BORATE GLASS ENCAPSULANT FOR LED PHOSPHORS

Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

BISMUTH BORATE GLASS ENCAPSULANT FOR LED PHOSPHORS

Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

Optical glass, optical element blank, glass material for press forming, optical element, and process for producing these
09656904 · 2017-05-23 · ·

An aspect of the present invention relates to an optical glass which contains P.sup.5+, Al.sup.3+, Ba.sup.2+, and R.sup.2+ (R.sup.2+ is one or more selected from the group including of Mg.sup.2+, Ca.sup.2+, Sr.sup.2+, and Zn.sup.2+) as essential cationic components and O.sup.2 and F.sup. as essential anionic components, the total content of P.sup.5+, Al.sup.3+, Ba.sup.2+, R.sup.2+, and R.sup.+ (R.sup.+ is one or more selected from the group including of Li.sup.+, Na.sup.+, and K.sup.+) in the cationic component being 86% or higher, the Al.sup.3+/P.sup.5+ molar ratio being 0.70 or higher, the Al.sup.3+/(Ba.sup.2++R.sup.2+) molar ratio being 0.40 or higher, and the Ba.sup.2+/(Ba.sup.2++R.sup.2+) molar ratio being in the range of 0.50 to 0.85, and which has an Abbe's number d of 72 or larger but less than 80, the refractive index nd and the Abbe's number d satisfying: nd2.1790.0085d.

Optical glass, optical element blank, glass material for press forming, optical element, and process for producing these
09656904 · 2017-05-23 · ·

An aspect of the present invention relates to an optical glass which contains P.sup.5+, Al.sup.3+, Ba.sup.2+, and R.sup.2+ (R.sup.2+ is one or more selected from the group including of Mg.sup.2+, Ca.sup.2+, Sr.sup.2+, and Zn.sup.2+) as essential cationic components and O.sup.2 and F.sup. as essential anionic components, the total content of P.sup.5+, Al.sup.3+, Ba.sup.2+, R.sup.2+, and R.sup.+ (R.sup.+ is one or more selected from the group including of Li.sup.+, Na.sup.+, and K.sup.+) in the cationic component being 86% or higher, the Al.sup.3+/P.sup.5+ molar ratio being 0.70 or higher, the Al.sup.3+/(Ba.sup.2++R.sup.2+) molar ratio being 0.40 or higher, and the Ba.sup.2+/(Ba.sup.2++R.sup.2+) molar ratio being in the range of 0.50 to 0.85, and which has an Abbe's number d of 72 or larger but less than 80, the refractive index nd and the Abbe's number d satisfying: nd2.1790.0085d.

Bismuth borate glass encapsulant for LED phosphors

Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

Bismuth borate glass encapsulant for LED phosphors

Embodiments are directed to glass frits containing phosphors that can be used in LED lighting devices and for methods associated therewith for making the phosphor containing glass frit and their use in glass articles, for example, LED devices.

Sealed devices comprising transparent laser weld regions

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Sealed devices comprising transparent laser weld regions

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A THERMOCHROMIC GLASS MATERIAL AND A PRODUCTION METHOD THEREOF

The present invention relates a thermochromic glass material comprising heavy metal oxide, alkali oxide, halide and at least one of other compounds supporting glass formation together with tellurium oxide (TeO.sub.2); and a production method thereof comprising the steps of preparing the powder mixture comprising TeO.sub.2 (101), melting the mixture by heating (102), cooling the molten mixture by pouring into a mold and obtaining glass (103), keeping the glass removed from the mold in a drying oven and cooling (104).

A THERMOCHROMIC GLASS MATERIAL AND A PRODUCTION METHOD THEREOF

The present invention relates a thermochromic glass material comprising heavy metal oxide, alkali oxide, halide and at least one of other compounds supporting glass formation together with tellurium oxide (TeO.sub.2); and a production method thereof comprising the steps of preparing the powder mixture comprising TeO.sub.2 (101), melting the mixture by heating (102), cooling the molten mixture by pouring into a mold and obtaining glass (103), keeping the glass removed from the mold in a drying oven and cooling (104).