Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

A paste for ceramic 3D shaping according to the present invention is a paste for ceramic 3D shaping containing a curable resin and inorganic particles, in which the inorganic particles contain ceramic particles and glass particles.

A fluid for stabilising solids formed from particulate material, the fluid comprising glass and a carrier. A method for preparing the fluid comprising melting and fritting a glass, milling the glass to form a powder and adding the milled glass to a carrier. A method of stabilising a solid formed from particulate material, the method comprising the steps of mixing the fluid with a particulate material and setting, and the use of the fluid, in geoengineering, building preservation, construction, tunnelling, landscape restoration, land remediation, and/or flood protection/remediation.

A fluid for stabilising solids formed from particulate material, the fluid comprising glass and a carrier. A method for preparing the fluid comprising melting and fritting a glass, milling the glass to form a powder and adding the milled glass to a carrier. A method of stabilising a solid formed from particulate material, the method comprising the steps of mixing the fluid with a particulate material and setting, and the use of the fluid, in geoengineering, building preservation, construction, tunnelling, landscape restoration, land remediation, and/or flood protection/remediation.

Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V.sub.2O.sub.5; 5 to 35 wt % P.sub.2O.sub.5; 0 to 30 wt % TeO.sub.2; 0 to 30 wt % Bi.sub.2O.sub.3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B.sub.2O.sub.3; 0 to 5 wt % total alkali metal oxides; 0 to 2 wt % Nb.sub.2O.sub.5; 0 to 2 wt % WO.sub.3; 0 to 2 wt % MoO.sub.3; 0 to 2 wt % SiO.sub.2; and 0 to 2 wt % Al.sub.2O.sub.3.

Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V.sub.2O.sub.5; 5 to 35 wt % P.sub.2O.sub.5; 0 to 30 wt % TeO.sub.2; 0 to 30 wt % Bi.sub.2O.sub.3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B.sub.2O.sub.3; 0 to 5 wt % total alkali metal oxides; 0 to 2 wt % Nb.sub.2O.sub.5; 0 to 2 wt % WO.sub.3; 0 to 2 wt % MoO.sub.3; 0 to 2 wt % SiO.sub.2; and 0 to 2 wt % Al.sub.2O.sub.3.

The present disclosure provides a method for coating a composite structure, comprising forming a first slurry by combining a first pre-slurry composition comprising a first phosphate glass composition, with a primary flow modifier and a first carrier fluid, wherein the primary flow modifier comprises at least one of cellulose or calcium silicate; applying the first slurry on a surface of the composite structure to form a base layer; and heating the composite structure to a temperature sufficient to adhere the base layer to the composite structure.