The present invention relates to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor and, more specifically, to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor, which enable a quantum dot (QD) and a structure, in which the QD is supported, to have a color conversion function for implementing white light. To this end, the present invention provides a substrate for the color conversion of a light-emitting diode, comprising: a first glass substrate arranged on a light-emitting diode; a second glass substrate formed to face the first glass substrate; a structure arranged between the first glass substrate and the second glass substrate, having a hollow portion and formed from a mixture of a yellow phosphor and a low-melting point frit glass; a QD filling the hollow portion; and sealing materials respectively formed between the first glass substrate and the lower side of the structure and between the second glass substrate and the upper side of the structure.

The present invention relates to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor and, more specifically, to a substrate for the color conversion of a light-emitting diode and a manufacturing method therefor, which enable a quantum dot (QD) and a structure, in which the QD is supported, to have a color conversion function for implementing white light. To this end, the present invention provides a substrate for the color conversion of a light-emitting diode, comprising: a first glass substrate arranged on a light-emitting diode; a second glass substrate formed to face the first glass substrate; a structure arranged between the first glass substrate and the second glass substrate, having a hollow portion and formed from a mixture of a yellow phosphor and a low-melting point frit glass; a QD filling the hollow portion; and sealing materials respectively formed between the first glass substrate and the lower side of the structure and between the second glass substrate and the upper side of the structure.

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).

Example embodiments relate to a composition for forming a solar cell electrode, and a solar cell electrode prepared using the composition. The composition for forming a solar cell electrode includes a silver (Ag) powder, a glass frit, and an organic vehicle, wherein the glass frit includes silver (Ag); tellurium (Te); and at least one selected from the group of lithium (Li), sodium (Na), and potassium (K), a molar ratio of the silver (Ag):the tellurium (Te) included in the glass frit is in a range of about 1:0.1 to about 1:50, and a molar ratio of the silver (Ag):lithium (Li), sodium (Na) or potassium (K) is in a range of about 1:0.01 to about 1:10. The solar cell electrode prepared using the composition has excellent fill factor and conversion efficiency due to minimized contact resistance (Rc) and series resistance (Rs).

An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.
V.sub.2O.sub.5+TeO.sub.2+Fe.sub.2O+P.sub.2O.sub.5≧90(mass %)  (1)
V.sub.2O.sub.5>TeO.sub.2>Fe.sub.2O.sub.3>P.sub.2O.sub.5 (mass %)  (2)

A feed-through through a housing part of a housing, for example of a battery or a capacitor made of a metal, wherein the housing part has at least one opening, through which at least one conductor is fed in a glass or glass ceramic material, and wherein the conductor has at least two sections in the axial direction, a first section made of a first material, e.g. aluminium, and a second section made of a second material, e.g. copper, as well as a transition from the first to the second material, and wherein the transition from the first to the second material is located in the region of the glass or glass ceramic material, said glass or glass ceramic material being adapted to the metal of the housing in such a way that a compression glass-to-metal seal is formed.

A feed-through through a housing part of a housing, for example of a battery or a capacitor made of a metal, wherein the housing part has at least one opening, through which at least one conductor is fed in a glass or glass ceramic material, and wherein the conductor has at least two sections in the axial direction, a first section made of a first material, e.g. aluminium, and a second section made of a second material, e.g. copper, as well as a transition from the first to the second material, and wherein the transition from the first to the second material is located in the region of the glass or glass ceramic material, said glass or glass ceramic material being adapted to the metal of the housing in such a way that a compression glass-to-metal seal is formed.

Provided is a process for producing a wavelength conversion member which can suppress the reaction between inorganic nanophosphor particles and glass to suppress the deterioration of the inorganic nanophosphor particles, and the wavelength conversion member. The process for producing a wavelength conversion member includes the steps of: preparing inorganic nanophosphor particles 1 with an organic protective film formed on respective surfaces thereof; and mixing the inorganic nanophosphor particles 1 with glass powder and firing a resultant mixture in a temperature range where the organic protective films remain as retained films 3.