A conductive paste composition, including aluminum powder; an organic carrier including an organic solvent and resin or cellulose; and phenoxy alkyl alcohol accounting for 210% of weight of the conductive paste composition. The conductive paste composition includes the phenoxy alkyl alcohol, and thus resultant conductive paste not only has enhanced surface tension, but also has an increased difference in surface tension between the resultant conductive paste and a cell to therefore alter wetting behavior between the paste and a silicon wafer, to reduce the broadening behavior of the wiring lines printed, increase the aspect ratio of printing wiring, increase the light-receiving area of the solar cells, and enhance the photovoltaic conversion efficiency of the solar cells (especially local back surface field solar cells and PERC bifacial cells).

The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes an organopolysiloxane and a fluorine-containing degradation agent.

The present invention provides a thick-film paste composition for printing the front side of a solar cell device having one or more insulating layers. The thick-film paste comprises an electrically conductive metal and an oxide composition dispersed in an organic medium that includes an organopolysiloxane and a fluorine-containing degradation agent.

A glass frit, according to an embodiment of the present invention, is a glass frit contained in a conductive paste for a solar cell electrode, which comprises an alkali metal oxide, wherein the total molar ratio of the alkali metal oxide to the total glass frit is 0.1 to 0.2.

A glass frit, according to an embodiment of the present invention, is a glass frit contained in a conductive paste for a solar cell electrode, which comprises an alkali metal oxide, wherein the total molar ratio of the alkali metal oxide to the total glass frit is 0.1 to 0.2.

A conductive paste composition contains a source of an electrically conductive metal, a first oxide component, a second, non-oxide, magnesium-containing component, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor device substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the substrate.

A conductive paste composition contains a source of an electrically conductive metal, a first oxide component, a second, non-oxide, magnesium-containing component, and an organic vehicle. An article such as a high-efficiency photovoltaic cell is formed by a process of deposition of the paste composition on a semiconductor device substrate (e.g., by screen printing) and firing the paste to remove the organic vehicle and sinter the metal and establish electrical contact between it and the substrate.

An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO.sub.2 is 3% by weight to 30% by weight.

An electro-conductive paste which includes an electro-conductive powder, a multiple oxide containing tellurium oxide, and an organic vehicle. The electro-conductive paste contains 0.1 parts by weight to 10 parts by weight of the multiple oxide based on 100 parts by weight of the electro-conductive powder, and the content ratio of the tellurium oxide in 100% by weight of the multiple oxide as TeO.sub.2 is 3% by weight to 30% by weight.

A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580 C. to 760 C. This chip resistor prevents the resistive element from being peeled off.