Coated glass or glass ceramic substrates having high temperature resistance, high strength, and a low coefficient of thermal expansion. The coating includes pores, is fluid-tight and suitable for coating a temperature-resistant, high-strength glass or glass ceramic substrate with a low coefficient of thermal expansion, and to a method for producing such a coated substrate.

A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.

[Ag.sub.2O]≥[TeO.sub.2]≥[V.sub.2O.sub.5]≥[Li.sub.2O]  (1)

2[V.sub.2O.sub.5]≥[Ag.sub.2O]+[Li.sub.2O]≥40  (2)

(In the formula, [X] represents a content of component X, and the unit thereof is “mol %”; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.

A substrate for a flexible device which includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer.

A substrate for a flexible device which includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer.

A method for manufacturing a glass panel unit includes a working step, an assembling step, a bonding step, and a gas exhausting step. The working step includes a getter material making step including obtaining a getter material containing a zeolite and a cerium compound. The assembling step includes preparing an assembly. The bonding step includes melting a peripheral wall to hermetically bond a first glass pane and a second glass pane. The gas exhausting step includes exhausting a gas from an internal space through an exhaust port to turn the internal space into a vacuum space.

An enamel composition, a method for preparing an enamel composition, and a cooking appliance are provided. The enamel composition may include 15 to 50 wt % of phosphorus pentoxide (P.sub.2O.sub.5); 1 to 20 wt % of silicon dioxide (SiO.sub.2); 1 to 20 wt % of boron oxide (B.sub.2O.sub.3); 5 to 20 wt % of one or more of lithium superoxide (Li.sub.2O), sodium oxide (Na.sub.2O), or potassium oxide (K.sub.2O); 1 to 5 wt % of one or more of sodium fluoride (NaF), calcium fluoride (CaF.sub.2), or aluminum fluoride (AlF.sub.3); 1 to 35 wt % of one or more of magnesium oxide (MgO), barium oxide (BaO), or calcium oxide (CaO); and 5 to 30 wt % of one or more of titanium dioxide (TiO.sub.2), vanadium pentoxide (V.sub.2O.sub.5), molybdenum trioxide (MoO.sub.3), or iron oxide (Fe.sub.2O.sub.3). With such an enamel composition, cleaning may be performed at a low temperature for thermal decomposition, and contaminants, such as fat, may be more completely removed.

An enamel composition, a method for preparing an enamel composition, and a cooking appliance are provided. The enamel composition may include 15 to 50 wt % of phosphorus pentoxide (P.sub.2O.sub.5); 1 to 20 wt % of silicon dioxide (SiO.sub.2); 1 to 20 wt % of boron oxide (B.sub.2O.sub.3); 5 to 20 wt % of one or more of lithium superoxide (Li.sub.2O), sodium oxide (Na.sub.2O), or potassium oxide (K.sub.2O); 1 to 5 wt % of one or more of sodium fluoride (NaF), calcium fluoride (CaF.sub.2), or aluminum fluoride (AlF.sub.3); 1 to 35 wt % of one or more of magnesium oxide (MgO), barium oxide (BaO), or calcium oxide (CaO); and 5 to 30 wt % of one or more of titanium dioxide (TiO.sub.2), vanadium pentoxide (V.sub.2O.sub.5), molybdenum trioxide (MoO.sub.3), or iron oxide (Fe.sub.2O.sub.3). With such an enamel composition, cleaning may be performed at a low temperature for thermal decomposition, and contaminants, such as fat, may be more completely removed.

To provide a dental porcelain paste which can maintain maintaining the paste state and have excellent application property for a long period of time and hardly causes carbonization or bubbles due to the influence of an organic component or a polymer component during firing. The present invention provides a dental porcelain paste for preparing a dental prosthesis device, comprising: 50.0 to 80.0 wt. % of a glass powder (a) having a maximum particle diameter of 100 μm or less and an average particle diameter of 1 to 20 μm, 0.5 to 10.0 wt. % of a hydrophobized fine particle silica (b) having an average primary particle diameter of 1 to 50 nm, and 10.0 to 49.5 wt. % of an organic solvent (c) having a boiling point it is within (bp) of 100 to 300° C.

To provide a dental porcelain paste which can maintain maintaining the paste state and have excellent application property for a long period of time and hardly causes carbonization or bubbles due to the influence of an organic component or a polymer component during firing. The present invention provides a dental porcelain paste for preparing a dental prosthesis device, comprising: 50.0 to 80.0 wt. % of a glass powder (a) having a maximum particle diameter of 100 μm or less and an average particle diameter of 1 to 20 μm, 0.5 to 10.0 wt. % of a hydrophobized fine particle silica (b) having an average primary particle diameter of 1 to 50 nm, and 10.0 to 49.5 wt. % of an organic solvent (c) having a boiling point it is within (bp) of 100 to 300° C.

A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.