A glass-film laminate or article having a narrow failure distribution or a Weibull modulus of greater than 10. In embodiments, the glass-film laminate or article includes at least one first film disposed on a strengthened glass substrate. A first film or any additional films can exhibit an average strain-to-failure that is less than the strain-to-failure of the strengthened glass substrate. In embodiments, the first first film is adhered to the glass substrate such that the first film does not exhibit visible delamination from the glass substrate. Methods of forming glass-film laminates or articles with a desired strength level and narrow failure strength distrubution are also disclosed.

The present invention relates to a nano bi-material, electromagnetic spectrum shifter based on said nano bi-material and method to produce said electromagnetic spectrum shifter using said nano bi-material. In particular, the present invention provides nano bi-material based electromagnetic spectrum shifter, e.g. color filters, with a wide range of transmission and color tunability and methods to produce said color filters. The present invention has applications in color filtration and production of color filters; reflector and production of reflectors; and electromagnetic spectrum shifter and production of electromagnetic spectrum shifters.

The present invention relates to a nano bi-material, electromagnetic spectrum shifter based on said nano bi-material and method to produce said electromagnetic spectrum shifter using said nano bi-material. In particular, the present invention provides nano bi-material based electromagnetic spectrum shifter, e.g. color filters, with a wide range of transmission and color tunability and methods to produce said color filters. The present invention has applications in color filtration and production of color filters; reflector and production of reflectors; and electromagnetic spectrum shifter and production of electromagnetic spectrum shifters.

A microelectrode or an array of microelectrodes for communicating with one or more adjacent electrically excitable cells. The microelectrode array comprises two or more microelectrodes. Each microelectrode comprises a body with a perimeter; an electrode wire that is electronically connected to the body and that is electronically connectible to an electronic system; and a ridge that extends away from the perimeter of the body for increasing a sealing-resistance value between the electrode and the one or more adjacent electrically excitable cells.

Certain example embodiments relate to heating a ceramic paint applied to a portion of a coated article in order to at least partially eat through the underlying coating, with any remaining materials being removable by washing, and associated articles. In certain example embodiments, the coatings are multilayer sputter-deposited coatings formed on a glass or other substrate. The heat may be provided in connection with conventional heat treatment (e.g., thermal tempering) and/or heat bending processes that otherwise would be performed on the coated article.

Certain example embodiments relate to heating a ceramic paint applied to a portion of a coated article in order to at least partially eat through the underlying coating, with any remaining materials being removable by washing, and associated articles. In certain example embodiments, the coatings are multilayer sputter-deposited coatings formed on a glass or other substrate. The heat may be provided in connection with conventional heat treatment (e.g., thermal tempering) and/or heat bending processes that otherwise would be performed on the coated article.

A layered structure, an article such as circuit board including such a layered structure, and methods of making the same are provided. The layered structure includes a substrate comprising glass or glass ceramic, an adhesion layer disposed on the substrate, a seed layer disposed on the adhesion layer, a first conductive layer disposed on the seed layer, and a second conductive layer disposed on the first conductive layer. The seed layer includes a first metal material and has a first type of stress with respect to the substrate. The first conductive layer includes the first metal material and has a second type of stress with respect to the substrate. The second conductive layer includes a second metal material and has the first type of stress with respect to the substrate. The layered structure may further include additional pairs of alternating layers of the first and the second conductive layers.

A layered structure, an article such as circuit board including such a layered structure, and methods of making the same are provided. The layered structure includes a substrate comprising glass or glass ceramic, an adhesion layer disposed on the substrate, a seed layer disposed on the adhesion layer, a first conductive layer disposed on the seed layer, and a second conductive layer disposed on the first conductive layer. The seed layer includes a first metal material and has a first type of stress with respect to the substrate. The first conductive layer includes the first metal material and has a second type of stress with respect to the substrate. The second conductive layer includes a second metal material and has the first type of stress with respect to the substrate. The layered structure may further include additional pairs of alternating layers of the first and the second conductive layers.

A method of manufacturing an optical device is disclosed. The method includes forming a waveguide in a glass plate. The method further includes scanning the glass plate with a laser beam directed at an acute angle with respect to a first surface to form a mirror trench in the glass plate. Scanning the glass plate with the first laser beam includes pulses of the laser beam that have a duration between 2 and 500 femtoseconds. The method also includes filling the mirror trench with a reflective material and depositing a cladding layer over the waveguide and mirror trench.

The disclosure relates to a metal nanowire structure. The metal nanowire structure includes a substrate and a metal nanowire film located on the substrate. The metal nanowire film includes a number of first metal nanowires parallel with and spaced from each other. A width of each of the plurality of first metal nanowires is in a range from about 0.5 nanometers to about 50 nanometers. Each of the plurality of first metal nanowires is a solid structure and consists of metal material.