A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.

A superstrate for forming a planarization layer on a substrate can include a body having a first surface, a second surface opposite the first surface, and a chamfered edge between the first surface and the second surface. An opaque layer can coat the chamfered edge. In another embodiment, an opaque layer can coat the chamfered edge and a portion of the second surface. The superstrate can be used for more planarization or other processing sequences without causing extrusion defects.

A method of producing a film of carbon nitride material, including the steps of providing a precursor of the carbon nitride material in a reacting vessel and a substrate substantially above the precursor of the carbon nitride material; heating the reacting vessel, the precursor of the carbon nitride material and the substrate at the first predetermined temperature; and quenching the reacting vessel to reach the second predetermined temperature; wherein the film of carbon nitride material is formed on a surface of the substrate during the quenching of the reacting vessel.

A material includes a glass sheet, one of the faces of which includes a first zone and a second zone, only the first zone being coated with a layer of opaque mineral paint obtained from a water-based paint composition including pigments and an aqueous solution of alkaline silicate, the layer of mineral paint and the second zone of the glass sheet being coated with a thin layer stack including at least one electrically conductive thin layer.

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

Asymmetrically strengthened glass articles, methods for producing the same, and use of the articles in portable electronic device is disclosed. Using a budgeted amount of compressive stress and tensile stress, asymmetric chemical strengthening is optimized for the utility of a glass article. In some aspects, the strengthened glass article can be designed for reduced damage, or damage propagation, when dropped.

Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.

A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σ.sub.tensile stress location)/(σ.sub.interface laser weld))<<1 or <1 and σ.sub.interface laser weld>10 MPa or >1 MPa where σ.sub.tensile stress location is the stress present in the first substrate and σ.sub.interface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

Methods and apparatus are provide for: a substrate having first and second opposing surfaces, and an elastic modulus; and layer(s) having a thickness between first and second opposing surfaces thereof, the first surface of the layer contacting the second surface of the substrate, forming an interface. The layer may exhibit one or more of: a first elastic modulus proximate to the first surface thereof and a second elastic modulus proximate to the second surface thereof, the second elastic modulus being substantially higher than the elastic modulus value, the first elastic modulus being lower than the elastic modulus of the substrate, the second elastic modulus being higher than the elastic modulus of the substrate, and the layer exhibiting an increasing elastic modulus gradient through the thickness thereof from the first elastic modulus to the second elastic modulus.

Methods and apparatus are provide for: a substrate having first and second opposing surfaces, and an elastic modulus; and layer(s) having a thickness between first and second opposing surfaces thereof, the first surface of the layer contacting the second surface of the substrate, forming an interface. The layer may exhibit one or more of: a first elastic modulus proximate to the first surface thereof and a second elastic modulus proximate to the second surface thereof, the second elastic modulus being substantially higher than the elastic modulus value, the first elastic modulus being lower than the elastic modulus of the substrate, the second elastic modulus being higher than the elastic modulus of the substrate, and the layer exhibiting an increasing elastic modulus gradient through the thickness thereof from the first elastic modulus to the second elastic modulus.