A device formation method may include printing a chalcogenide glass ink onto a surface to form a chalcogenide glass layer, where the chalcogenide glass ink comprises chalcogenide glass and a fluid medium. The method may further include sintering the chalcogenide glass layer at a first temperature for a first duration. The method may also include annealing the chalcogenide glass layer at a second temperature for a second duration. A device may include a substrate and a printed chalcogenide glass layer on the substrate, where the printed chalcogenide glass layer includes annealed chalcogenide glass, and where the printed chalcogenide glass layer is free from cracks.

A device formation method may include printing a chalcogenide glass ink onto a surface to form a chalcogenide glass layer, where the chalcogenide glass ink comprises chalcogenide glass and a fluid medium. The method may further include sintering the chalcogenide glass layer at a first temperature for a first duration. The method may also include annealing the chalcogenide glass layer at a second temperature for a second duration. A device may include a substrate and a printed chalcogenide glass layer on the substrate, where the printed chalcogenide glass layer includes annealed chalcogenide glass, and where the printed chalcogenide glass layer is free from cracks.

Disclosed are device display screen protectors comprising a first strengthened substrate sized to cover a display screen of an electronic device, the first strengthened substrate having a central tension value in the range greater than 0 MPa and less than 20 MPa, a surface having a Knoop lateral cracking scratch threshold of at least 3 N.

A shaped glass article is provided that is ultrathin, has two surfaces and one or more edges joining the two surfaces, and a thickness between the two surfaces. The shaped ultrathin glass article has at least one curved area with a non-vanishing surface curvature with a minimal curvature radius R if no external forces are applied. A method for producing a shaped glass article is also provided that includes providing an ultrathin glass with two surfaces and one or more edges joining the two surfaces, having a thickness between the two surfaces and shaping the ultrathin glass to a shaped ultrathin glass article by forming at least one curved area having a non-vanishing surface curvature with a minimal curvature radius R if no external forces are applied to the shaped ultrathin glass article.

Glass-based articles article are described and have a first surface and a second surface opposing the first surface defining a thickness (t) (mm); and a compressive stress (CS) layer containing ion-exchanged potassium and ion-exchanged silver or ion-exchanged potassium and ion-exchanged copper, the CS layer extending from the first surface to a depth of compress (DOC), wherein the DOC is in a range of 0.1.Math.t and 0.3.Math.t, the CS at the first surface in a range of 300 MPa and 1500 MPa and defining a compressive stress profile including a spike region, a tail region and a knee region between the spike region and the tail region, wherein all points of the stress profile in the spike region comprise a tangent having a value that is in a range of 15 MPa/micrometer and 200 MPa/micrometer and all points in the tail region comprise a tangent having a value that is in a range of 0.01 MPa/micrometer and 3 MPa/micrometer.

The prism coupling methods disclosed herein are directed to determining a stress characteristic of an original IOX article having a buried IOX region with a buried refractive index profile that is problematic in the sense that it prevents the original IOX article from being measured using a prism coupler system. The methods include modifying the buried IOX region of the original IOX article in a surface portion of the buried IOX region to form a modified IOX article having an unburied refractive index profile that allows the modified IOX article to be measured using a prism coupler. The methods also include measuring a mode spectrum of the modified IOX article using the prism coupler system. The methods further include determining one or more stress characteristic of the original IOX article from the mode spectrum of the modified IOX article.

The low-loss ion exchanged (IOX) waveguide disclosed herein includes a glass substrate having a top surface and comprising an alkali-aluminosilicate glass with between 3 and 15 mol % of Na.sub.2O and a concentration of Fe of 20 parts per million (ppm) or less. The glass substrate includes a buried AgNa IOX region, wherein this region and a surrounding portion of glass substrate define the IOX waveguide. The IOX waveguide has an optical loss OL0.05 dB/cm and a birefringence magnitude |B|0.001. The glass substrate with multiple IOX waveguides can be used as an optical backplane for systems having optical functionality and can find use in data center and high-performance data transmission applications.

Disclosed is a mother glass. The mother glass has a thickness range of 0.4 mm-2.0 mm, the transmittance of light with wavelength of 550 nm to the mother glass is in a range of 86%-92.2%; the refraction coefficient of the mother glass is in a range of 1.48-1.54; and the alkali metal oxide content in the mother glass is 11 mol %-22 mol %, wherein the Na oxide content is 5 mol %-18 mol %, and the Al oxide content is 7 mol %-16 mol %. A reinforced glass prepared from the same mother glass and a preparation method therefore are also disclosed.

The present invention is directed to a kind of machinable glass ceramic which can be chemically toughened. The machinable and chemically toughenable glass ceramic, which comprises, as represented by weight percentage based on the following compositions, 25-75 wt % of SiO.sub.2, 6-30 wt % of Al.sub.2O.sub.3, 0.1-30 wt % of Na.sub.2O, 0-15 wt % of K.sub.2O, 0-30 wt % of B.sub.2O.sub.3, 4-35 wt % of MgO, 0-4 wt % of CaO, 1-20 wt % of F, 0-10 wt % of ZrO.sub.2, 0.1-10 wt % of P.sub.2O.sub.5, 0-1 wt % of CeO.sub.2 and 0-1 wt % of SnO.sub.2, wherein P.sub.2O.sub.5+Na.sub.2O>3 wt %, and Al.sub.2O.sub.3+Na.sub.2O+P.sub.2O.sub.5>17 wt %. Mica crystalline phase can be formed in the glass ceramic and the glass ceramic can be chemically toughened by one step, two steps or multiple steps with depth of K-ion layer of at least 15 m and surface compress stress of at least 300 MPa. The profile on depth of the ion exchange layer follows the complementary error function. Hardness can be improved by at least 20% after chemical toughening. The dimension deviation ratio is less than 0.06% by ion-exchanging.

Embodiments disclosed therein generally pertain to selectively strengthening glass. More particularly, techniques are described for selectively strengthening cover glass, which tends to be thin, for electronic devices, namely, portable electronic devices.