Methods for increasing the strength of a planar or strip-shaped glass substrate are provided. Electromagnetic radiation in the wavelength range from 180 nm to 1100 nm is applied to the glass substrate by means of at least one pulse, wherein the at least one pulse has a radiation bandwidth of at least 100 nm and the glass substrate has a temperature of at most 200° C. prior to the at least one pulse acting thereon, and wherein the pulse energy density of the at least one pulse of electromagnetic radiation is set in the range from 0.1 Jcm-2 to 100 Jcm-2.

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

A copper-doped glass formed by placing a target glass in a container, surrounding the target glass with a powder mixture comprised of SiO.sub.2 powder and Cu.sub.2S powder, wherein the SiO.sub.2 powder and the Cu.sub.2S powder are mixed according to the formula (SiO.sub.2).sub.(1-x)(Cu.sub.2S).sub.x, where 0.01<x<0.1, and heated to a temperature of between 800° C. and 1150° C. for a duration of between 1 and 10 hours.

The present disclosure relates to a method of making a lensed connector in which a glass ferrule has holes within the body of the glass ferrule, and the glass ferrule is subsequently processed to form lens structures along the ferrule.

Photosensitive lithium zinc aluminosilicate glasses that can be selectively irradiated and cerammed to provide patterned regions of glass and lithium-based glass ceramic, and composite glass articles made from such glasses and glass ceramics are provided. The lithium zinc aluminosilicate glass can be negatively photosensitive or positively photosensitive to radiation having a wavelength in a range from about 248 nm to about 360 nm.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

A coated glazing includes a transparent glass substrate and a coating located on the glass substrate. The coating includes at least the following layers in sequence starting from the glass substrate: a first layer having a refractive index of more than 1.6, an optional second layer having a refractive index that is less than the refractive index of the first layer, a third layer based on tin dioxide doped with fluorine, and a fourth layer based on titanium oxide, wherein the fourth layer is photocatalytic.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

A method of manufacturing a window may include cutting a window having a uniform thickness of about 20 μm to about 100 μm and polishing a cut surface of the window with a polishing pad having an elastic modulus less than an elastic modulus of the window while applying slurry to the cut surface of the window.

Multicolored glass-based articles and methods of manufacture are disclosed. The method includes forming a glass-based part and exposing a first region to radiation and a second region to radiation such that the first and second regions have different sized metallic nanoparticles, resulting in a multicolored glass article.