C03C23/0025

GLASS-CERAMIC ARTICLES WITH HIGH DYNAMIC RANGE TRANSMITTANCE VIA LASER BLEACHING

An article includes a glass ceramic that has an amorphous silicate glass phase and a crystalline phase including a species of MxWO3 with 0<x<1 and M an intercalated dopant cation. The article further includes an aperture configured to be formed via local heating of a portion of the glass ceramic to a temperature that is above the softening point of the glass ceramic. The aperture comprises constituents of the silicate glass phase and the crystalline phase but is substantially free of the species of MxWO3. A ratio of a transmittance of the aperture to a transmittance of the glass ceramic not subject to the local heating is at least 6,000 with transmittance measured in %/mm at wavelengths from 500 nm to 1100 nm.

COATING-REMOVAL DEVICE AND METHOD FOR REMOVING COATINGS FROM GLASS PANES, AND METHOD FOR PRODUCING GLASS PANES FOR STEPPED-EDGE GLASS, STEPPED-EDGE GLASS AND STEPPED-EDGE GLASS WINDOW AND USE OF THE GLASS PANE FOR AN INSULATING GLAZING UNIT, IN PARTICULAR FOR STEPPED-EDGE GLASS OF A STEPPED-EDGE GLASS WINDOW
20220340484 · 2022-10-27 ·

The present invention relates to a coating-removal device and to a coating-removal method for removing coatings at the edge of glass panes and to a method for producing glass panes for stepped-edge glass, to stepped-edge glass and to stepped-edge glass window with such stepped-edge glass.

Method for introducing at least one cutout or aperture into a sheetlike workpiece

A method for introducing at least one cutout, in particular in the form of an aperture, into a sheetlike workpiece having a thickness of less than 3 mm, involving detecting a laser beam onto the surface of the workpiece, selecting the exposure time of the laser beam to be extremely short so that only a modification of the workpiece concentrically around a beam axis of the laser beam occurs, such a modified region having defects resulting in a chain of blisters, and, as a result of the action of a corrosive medium, anisotropically removing material by successive etching in those regions of the workpiece that are formed by the defects and have previously been modified by the laser beam, resulting, along the cylindrical zone of action, in producing a cutout as an aperture in the workpiece.

Micro-perforated panel systems, applications, and methods of making micro-perforated panel systems

The described embodiments relate generally to a micro-perforated panel systems and methods for noise abatement and method of making a micro-perforated panel system. In particular, embodiments relate to glass micro-perforated panel systems and methods for their construction.

APPARATUS FOR REMOVING AT LEAST ONE PORTION OF AT LEAST ONE COATING SYSTEM PRESENTING A MULTI-GLAZED WINDOW AND ASSOCIATED METHOD

An apparatus for removing a portion of a coating system present in a multi-glazed window including: a decoating component to focus a laser source at a focus distance; two motors to move the decoating component along the X and Y axis; one optical system to detect on which interface the coating system is localized, and to estimate a distance between the decoating component and the detected interface; a third motor to control the position of the decoating component along a Z axis; and a displacement control unit of the third motor to displace the decoating component of a displacement distance equal to the difference between the estimated distance and said the distance in order to focus the decoating component on the detected interface.

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

Optical processing apparatus, optical processing method, and optically-processed product production method
11482826 · 2022-10-25 · ·

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

Glass electrochemical sensor with wafer level stacking and through glass via (TGV) interconnects

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

REAL-TIME MODIFICATION OF LINE FOCUS INTENSITY DISTRIBUTION
20220326539 · 2022-10-13 ·

Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

SUBSTRATE, METHOD FOR SEPARATING THE SUBSTRATE, AND DISPLAY PANEL

A substrate, a method for separating the substrate, and a display panel are provided. The substrate is disposed on a glass substrate. The substrate includes a substrate layer and a sacrificial layer. The sacrificial layer disposed between the substrate layer and the glass substrate, and is configured to share the force exerted on the substrate layer when the substrate is being separated from the glass substrate.