A method of forming a multi-colored glass substrate comprises: irradiating a first region of a glass substrate with a first high energy source to form a first irradiated glass substrate; and subjecting the irradiated glass substrate to a first heat treatment to form a first heat treated glass substrate, wherein the first heat treated glass substrate comprises a second region having a different transmittance color coordinate in the CIELAB color space, as measured at an article thickness of 1.33 mm under F2 illumination and a 10° standard observer angle, than the first region.

A sealed glass package includes a top substrate and a bottom substrate, each of the top substrate and the bottom substrate comprising a first major surface and a second major surface opposite the first major surface; a central substrate disposed between the second major surface of the top substrate and the first major surface of the bottom substrate, the central substrate including a cavity filled by a first liquid and a second liquid; a polymer disposed between the second major surface of the top substrate and the central substrate; a first laser bond joining and hermetically sealing the first major surface of the bottom substrate and the central substrate; and a second laser bond joining and hermetically sealing the second major surface of the top substrate and the central substrate.

A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

A display panel may include a first display substrate, a second display substrate disposed over the first display substrate, and a sealing member bonding the first display substrate and the second display substrate. The sealing member may include a frit sealing member including an outer region and an inner region, with the inner region disposed next to an inner side of the outer region and having a first crystallization temperature lower than a second crystallization temperature of the outer region, and an organic sealing member disposed next to an inner side of the frit sealing member.

Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having first and second surfaces includes directing a beam of laser light to pass through the first surface and, thereafter, to pass through the second surface. The beam of laser light has a beam waist located at a surface of the substrate or outside the substrate. Relative motion between the beam of laser light and the substrate is caused to scan a spot on a surface of the substrate to be scanned along a guide path. Portions of the substrate illuminated within the spot absorb light within the beam of laser light so that the substrate can be separated along the guide path.

Asymmetrically strengthened glass articles, methods for producing the same, and use of the articles in portable electronic device is disclosed. Using a budgeted amount of compressive stress and tensile stress, asymmetric chemical strengthening is optimized for the utility of a glass article. In some aspects, the strengthened glass article can be designed for reduced damage, or damage propagation, when dropped.

A technical object of the present invention is to devise a glass sheet that is suitable for supporting a substrate to be processed to be subjected to high-density wiring and has high end surface strength, and a method of manufacturing the glass sheet, to thereby contribute to an increase in density of a semiconductor package. The glass sheet of the present invention has a total thickness variation of less than 2.0 μm, all or part of an end surface of the glass sheet including a melt-solidified surface.

Some embodiments of present disclosure are directed to a micro-perforated glass or glass-ceramics laminate, comprising a first substrate laminated to a second substrate by a first polymer interlayer, wherein the first and the second substrates are independently selected from glass or glass-ceramics, and a plurality of micro-perforations, each of the plurality of micro-perforations extending through the first substrate, the first polymer interlayer, and the second substrate. Some embodiments are directed to methods of forming such micro-perforated glass or glass-ceramics laminates.

A method for forming ion-exchanged regions in a glass article by contacting an ion source with at least one surface of the glass article, forming a first ion-exchanged region in the glass article by heating a first portion of the glass article with a laser, and forming a second ion-exchanged region in the glass article. Characteristics of the first ion-exchanged region may be different from characteristics of the second ion-exchanged region. A depth of the ion-exchanged region may be greater than 1 μm. A glass article including a first ion-exchanged region, and a second ion-exchanged region having different characteristics from the first ion-exchanged region. The thickness of the glass article is less than or equal to about 0.5 mm.

The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.