A vacuum insulated glazing can be manufactured using a variety of methods. In one embodiment, a glass substrate is patterned and etched to form recesses in the surface of the glass substrate. The recesses or etched areas form a chamber when the glass substrate is bonded to another glass substrate. In another embodiment, nanoparticles and/or microparticles that absorb laser light are positioned between two glass substrates and heated to bond the glass substrates together. In another embodiment, a tempered glass substrate is bonded to another glass substrate to form a chamber between the substrates. The curved edges of the tempered glass are removed to produce a flat vacuum insulated glazing.

A vacuum insulated glazing can be manufactured using a variety of methods. In one embodiment, a glass substrate is patterned and etched to form recesses in the surface of the glass substrate. The recesses or etched areas form a chamber when the glass substrate is bonded to another glass substrate. In another embodiment, nanoparticles and/or microparticles that absorb laser light are positioned between two glass substrates and heated to bond the glass substrates together. In another embodiment, a tempered glass substrate is bonded to another glass substrate to form a chamber between the substrates. The curved edges of the tempered glass are removed to produce a flat vacuum insulated glazing.

Disclosed herein are seals for liquid-tight bonding of an optical window comprising a BiIn alloy. Also disclosed are optical cells comprising the BiIn alloy seals to provide a liquid-tight seal between a cell housing and a drilled optical window.

Disclosed herein are seals for liquid-tight bonding of an optical window comprising a BiIn alloy. Also disclosed are optical cells comprising the BiIn alloy seals to provide a liquid-tight seal between a cell housing and a drilled optical window.

Certain example embodiments relate to vacuum insulating glass units having pump-out hole seals formed in connection with solder alloys that, when reactively reflowed, wet pre-coated metallic coatings, and/or associated methods. The alloys may be based on materials that form seals at temperatures that will not de-temper glass and/or decompose a laminate, and/or remain hermetic and lack porous structures in their bulks. SAC, InAg, and/or other preform materials may be used in different example embodiments.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20 C. higher than a flow point of the glass composition.

An object of the present invention is to provide a multi-layer glass with high degree of vacuum and high mass productivity. In order to achieve the object, the multi-layer glass according to the present invention includes a first glass substrate, a second glass substrate disposed facing the first glass substrate with a space therebetween, a sealing portion, which contains a glass composition and is disposed in a peripheral edge portion of the space between the first glass substrate and the second glass substrate, and column members disposed between the first glass substrate and the second glass substrate, wherein the column member is made of a metal or alloy, and a melting point of the metal or alloy is higher than a softening point of the glass composition and is lower than or equal to a temperature 20 C. higher than a flow point of the glass composition.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.