Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

A method for manufacturing a microfluidic device (100) includes depositing a bonding layer (106) on a surface of a second glass layer (104a) of a glass substrate having a first glass layer (102) and the second glass layer (104a) fused to the first glass layer (102), such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel (112) in the glass substrate; and bonding a cover (108) to the glass substrate with the bonding layer (106).

A method for manufacturing a microfluidic device includes depositing a bonding layer on a surface of a second glass layer of a glass substrate having a first glass layer and the second glass layer fused to the first glass layer, such that a masked region of the surface is covered by the bonding layer, and an exposed region of the surface is uncovered by the bonding layer; removing a portion of the second glass layer corresponding to the exposed region of the surface to form a flow channel in the glass substrate; and bonding a cover to the glass substrate with the bonding layer.

A bonded article includes a first substrate, a second substrate, and a bonding layer disposed between the first substrate and the second substrate. The bonding layer includes a conducting layer and a capping layer. The first substrate is bonded to the second substrate at a bonded region extending along a bond track. The bonded region is substantially continuous between the first substrate and the second substrate.

A vacuum insulated glass product and the method for making the same, wherein the vacuum insulated glass comprises: a first glass substrate; a second glass substrate disposed facing the first glass substrate; a sealing structure provided between the first glass substrate and the second glass substrate and used for airtight binding of the first glass substrate and the second glass substrate to form a vacuum cavity; and a plurality of supports provided inside the vacuum cavity for bearing pressure from the first glass substrate and the second glass substrate. The sealing structure comprises: metal layers which are fixedly formed on facing surfaces of the first glass substrate and the second glass substrate, and an intermediate solder layer which is disposed between and connects the metal layers. The sealing structure has arc-shaped transition structures at the corner areas of the glass substrates.

A vacuum insulated glass product and the method for making the same, wherein the vacuum insulated glass comprises: a first glass substrate; a second glass substrate disposed facing the first glass substrate; a sealing structure provided between the first glass substrate and the second glass substrate and used for airtight binding of the first glass substrate and the second glass substrate to form a vacuum cavity; and a plurality of supports provided inside the vacuum cavity for bearing pressure from the first glass substrate and the second glass substrate. The sealing structure comprises: metal layers which are fixedly formed on facing surfaces of the first glass substrate and the second glass substrate, and an intermediate solder layer which is disposed between and connects the metal layers. The sealing structure has arc-shaped transition structures at the corner areas of the glass substrates.

An induction-heating welding method for vacuum insulated glass comprising upper and lower glass substrates is disclosed. Metal layers are prepared in regions to be sealed for the upper and lower glass substrates. A continuous solder is distributed on the metal layer in the lower glass substrate's region to be sealed. The upper and lower glass substrates are superposed. During welding, a high-frequency induction welding head's center moves forward along a centerline of a width of the metal layers; during induction heating of the metal layers in a corner region, a relative position between a movement route of the high-frequency induction welding head's center and the centerline of the width of the metal layers is changed, so that the movement route deviates from the centerline of the width of the metal layers, and thus reducing induction power and avoiding overheating of the metal layers in the corner region.

Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.