Patent classifications
C03C27/08
Site-specific connecting of glass substrates
The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.
Site-specific connecting of glass substrates
The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.
INDUCTION-HEATING WELDING METHOD FOR VACUUM INSULATED GLASS
An induction-heating welding method for vacuum insulated glass comprising upper and lower glass substrates is disclosed. Metal layers are prepared in regions to be sealed for the upper and lower glass substrates. A continuous solder is distributed on the metal layer in the lower glass substrate's region to be sealed. The upper and lower glass substrates are superposed. During welding, a high-frequency induction welding head's center moves forward along a centerline of a width of the metal layers; during induction heating of the metal layers in a corner region, a relative position between a movement route of the high-frequency induction welding head's center and the centerline of the width of the metal layers is changed, so that the movement route deviates from the centerline of the width of the metal layers, and thus reducing induction power and avoiding overheating of the metal layers in the corner region.
Vacuum Insulated Glass Product
A vacuum insulated glass product and the method for making the same, wherein the vacuum insulated glass comprises: a first glass substrate; a second glass substrate disposed facing the first glass substrate; a sealing structure provided between the first glass substrate and the second glass substrate and used for airtight binding of the first glass substrate and the second glass substrate to form a vacuum cavity; and a plurality of supports provided inside the vacuum cavity for bearing pressure from the first glass substrate and the second glass substrate. The sealing structure comprises: metal layers which are fixedly formed on facing surfaces of the first glass substrate and the second glass substrate, and an intermediate solder layer which is disposed between and connects the metal layers. The sealing structure has arc-shaped transition structures at the corner areas of the glass substrates.
FUNCTIONAL ELEMENT AND METHOD OF MANUFACTURING FUNCTIONAL ELEMENT, AND ELECTRONIC APPARATUS
A functional element according to an embodiment of the present disclosure includes: a first substrate; a second substrate disposed to face the first substrate; and a buffer layer provided between the first substrate and the second substrate. The buffer layer has, in a layer thereof, a distribution of concentration of a metallic element. The distribution changes in a film thickness direction.
FUNCTIONAL ELEMENT AND METHOD OF MANUFACTURING FUNCTIONAL ELEMENT, AND ELECTRONIC APPARATUS
A functional element according to an embodiment of the present disclosure includes: a first substrate; a second substrate disposed to face the first substrate; and a buffer layer provided between the first substrate and the second substrate. The buffer layer has, in a layer thereof, a distribution of concentration of a metallic element. The distribution changes in a film thickness direction.
METHODS OF BONDING AN OPTICAL FIBER TO A SUBSTRATE USING A LASER AND ASSEMBLIES FABRICATED BY THE SAME
Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.
METHODS OF BONDING AN OPTICAL FIBER TO A SUBSTRATE USING A LASER AND ASSEMBLIES FABRICATED BY THE SAME
Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.
Bismuth-indium alloy for liquid-tight bonding of optical windows
Disclosed herein are seals for liquid-tight bonding of an optical window comprising a BiIn alloy. Also disclosed are optical cells comprising the BiIn alloy seals to provide a liquid-tight seal between a cell housing and a drilled optical window.
Bismuth-indium alloy for liquid-tight bonding of optical windows
Disclosed herein are seals for liquid-tight bonding of an optical window comprising a BiIn alloy. Also disclosed are optical cells comprising the BiIn alloy seals to provide a liquid-tight seal between a cell housing and a drilled optical window.