A method of bonding transparent substrates is provided, comprising: preparing a pair of transparent substrates; forming a thin film of aluminum oxide by a sputtering method, on a bonding surface of the transparent substrates; contacting the aluminum oxide thin films in the air to bond the pair of transparent substrates; and heating the bonded pair of transparent substrates.

A composite pane includes an outer pane, an inner pane, and a thermoplastic intermediate layer. The composite pane has, between the outer and inner panes, a solar protection coating that substantially reflects or absorbs rays outside the visible spectrum of solar radiation. The solar protection coating includes starting from the outer pane, a layer sequence of first dielectric module (M1), first silver layer (Ag1), second dielectric module (M2), second silver layer (Ag2), third dielectric module (M3), third dielectric module (M3), third silver layer (Ag3), fourth dielectric module (M4), wherein the silver layers (Ag1, Ag2, Ag3) have a layer thickness relative to one another of Ag1/Ag2>1 and Ag1/Ag3>1, and the dielectric modules (M1, M2, M3, M4) have a relative layer thickness of M2/M1>1, M2/M3>1, and M2/M4>1.

A laminated glazing includes a first sheet of a colored glass and a second sheet of a clear glass which are joined together by a lamination interlayer, the first sheet having a thickness el ranging from 1.5 to 2.5 mm, the second sheet having a thickness e2 ranging from 0.4 to 1.9 mm, the ratio R=e2/e1.sup.2 being at most 0.40 mm.sup.−1, the glazing having a light transmission of at least 70% and a direct solar transmission of at most 55%, the colored glass having a chemical composition including a weight content of total iron, expressed in the form Fe.sub.2O.sub.3, ranging from 1.1 to 2.0%, with a redox ratio, defined as the ratio between the weight content of ferrous iron, expressed in the form FeO, and the weight content of total iron, expressed in the form Fe.sub.2O.sub.3, ranging from 0.23 to 0.32.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.

Coated glass panes having a glass pane and a coating in at least one region of at least one side of the glass pane. The glass pane is composed of glass with SiO.sub.2 and B.sub.2O.sub.3. The coating includes first coating applied in at least one region of the at least one side. The first coating has a binder with SiO.sub.2 and a pigment. The glass pane, in the at least one region, has a flexural strength between at least 5 and at most 170 MPa.

A curing device is positionable to a mount on a resin injector to cure the resin injected into a defect in glass. A housing of the curing device is removably positionable to a mounted position on the resin injector. When in the mounted position the curing device positions a light area from light emitters to an area surrounding the nozzle of the injector to provide curing of the injected resin. A GPS locator can ascertain a location, date, and time of use of the curing device and store such use information in electronic memory.

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a coating layer comprising a cationic surfactant or a coating layer comprising an organic salt, and associated deposition methods. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (? 500° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.