A vehicular interior rearview mirror assembly includes a mounting portion, a mirror casing and a mirror reflective element. The reflective element includes a glass substrate having a planar front surface, a planar rear surface and a circumferential perimeter edge around a periphery of the glass substrate that extends across a thickness dimension separating the planar front surface from the planar rear surface. A front perimeter edge portion of the circumferential perimeter edge includes a rounded glass surface circumferentially around the periphery of the glass substrate, with the rounded glass surface at least partially spanning the thickness dimension of the glass substrate. The rounded glass surface has a radius of curvature of at least 2.5 mm. The planar rear surface of the glass substrate is coated with a coating. No portion of the mirror casing overlaps onto the rounded glass surface of the glass substrate.

The present invention relates to a glass including, in mole percentage on an oxide basis: 60-75% of SiO.sub.2; 8-20% of Al.sub.2O.sub.3; 5-16% of Li.sub.2O; and 2-15% of one or more kinds of Na.sub.2O and K.sub.2O in total, in which a ratio P.sub.Li of the content of Li.sub.2O to a total content of Li.sub.2O, Na.sub.2O, and K.sub.2O is 0.40 or more, and a total content of MgO, CaO, SrO, BaO, and ZnO is 0-10%.

Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa.Math.m.sup.1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm.sup.2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

Articles and methods regarding composite conductor materials comprising a first conductive material layer and a first carbonaceous material layer. In certain embodiments, the first carbonaceous material layer comprises an sp2 hybridized carbon compound. In certain embodiments, the electrical conductivity of the composite conductive material can be controlled and exhibits a conductivity at least 1.5% greater than the conductivity of the first conductive material layer alone.

A nanoparticle coater includes a housing; a nanoparticle discharge slot; a first combustion slot; and a second combustion slot.

A sensitizing solution, especially a sensitizing solution for sensitizing surfaces, containing a solution of tin(II) chloride SnCl.sub.2 and distilled water, especially for sensitizing non-conductive surfaces, which further contains glycerine. A method of preparation of the sensitizing solution, especially the method of preparation of the sensitizing solution, according to which the solution of tin(II) chloride SnCl.sub.2 and distilled water is mixed with a reducing agent, which is glycerine.

A method of manufacturing a coated glass article that includes (i) preparing a glass substrate having a first and second opposed main surfaces, (ii) irradiating at least the first main surface of the glass substrate with a laser to form at least one separating line defining contour lines, for dividing at least one glass article from the glass substrate, the glass article having a shape and/or size different from the glass substrate of step (i), (iii) chemically strengthening the glass substrate on which at least one separating line is formed, the separating line extending in a depth direction from the first main surface to the second main surface, and (iv) separating of the at least one glass article from the glass substrate according to the at least one separating line. In addition, the glass substrate is coated between steps (iii) and (iv).

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.

Embodiments of an enclosure including a substrate having an anti-fingerprint surface are disclosed. The anti-fingerprint surface may include a textured surface, a coated surface or a coated textured surface that exhibits a low fingerprint visibility, when a fingerprint is applied to the anti-fingerprint surface. In one or more embodiments, the enclosure exhibits any one of the following attributes (1) radio, and microwave frequency transparency, as defined by a loss tangent of less than 0.03 and at a frequency range of between 15 MHz to 3.0 GHz; (2) infrared transparency; (3) a fracture toughness of greater than 0.6 MPa.Math.m.sup.1/2; (4) a 4-point bend strength of greater than 350 MPa; (5) a Vickers hardness of at least 450 kgf/mm.sup.2 and a Vickers median/radial crack initiation threshold of at least 5 kgf; (6) a Young's Modulus in the range from about 50 GPa to about 100 GPa; and (7) a thermal conductivity of less than 2.0 W/m° C.

Transparent conductive coatings are polished using particle slurries in combination with mechanical shearing force, such as a polishing pad. Substrates having transparent conductive coatings that are too rough and/or have too much haze, such that the substrate would not produce a suitable optical device, are polished using methods described herein. The substrate may be tempered prior to, or after, polishing. The polished substrates have low haze and sufficient smoothness to make high-quality optical devices.