Components of an electronic device, such as glass articles, are susceptible to breakage, especially in regions where machining a glass article has created flaws. Chemical strengthening can be performed to create deeper compression layers at regions of a glass article that have been machined, include and/or are adjacent to an edge feature, have greater surface roughness, and/or have more or deeper cracks.

A method for creating a random anti-reflective surface structure on an optical fiber including a holder configured to hold the optical fiber comprising a groove and a fiber connector, an adhesive material to hold the optical fiber in the holder and fill any gap between the optical fiber and the holder, a glass to cover the adhesive material and the optical fiber, and a reactive ion etch device. The reactive ion etch device comprises a plasma and is configured to expose an end face of the optical fiber to the plasma. The plasma is configured to etch a random anti-reflective surface structure on the end face of the optical fiber.

An object of the present invention is to provide a chemically strengthened glass having enhanced surface strength and bending strength. The present invention relates to a chemically strengthened glass having a compressive stress layer formed on a surface layer thereof by an ion exchange method, in which a straight line obtained by a linear approximation of a hydrogen concentration Y in a region of a depth X from an outermost surface of the glass satisfies a specific relational equation (I) in X=0.1 to 0.4 (m), and an edge surface connecting main surfaces on a front side and a back side of the glass has a skewness (Rsk) measured based on JIS B0601 (2001) being 1.3 or more.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.

A method for producing a glass substrate with through glass vias according to the present invention includes: irradiating a glass substrate (10) with a laser beam to form a modified portion; forming a first conductive portion (20a) on a first principal surface of the glass substrate (10), the first conductive portion (20a) being positioned in correspondence with the modified portion (12); and forming a through hole (14) in the glass substrate (10) after formation of the first conductive portion by etching at least the modified portion (12) using an etchant. This method allows easy handling of a glass substrate during formation of a conductive portion such as a circuit on the glass substrate, and is also capable of forming a through hole in the glass substrate relatively quickly while preventing damage to the conductive portion such as a circuit formed on the glass substrate.

The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

A plasma etching method using a Faraday cage, comprising: providing a Faraday cage having a mesh portion on an upper surface thereof in a plasma etching apparatus; providing a quartz substrate having a metal mask with an opening provided on one surface of the metal mask in the Faraday cage; and patterning the quartz substrate with plasma etching.

Various embodiments herein relate to electrochromic windows that are bird friendly, as well as methods and apparatus for forming such windows. Bird friendly windows include one or more elements that make the window visible to birds so that the birds recognize that they cannot fly through the window. Bird friendly windows can be used to minimize avian-window collisions, and therefore minimize avian deaths resulting from such collisions. In various embodiments, a window may be patterned such that the pattern is visible to birds. In these or other cases, the window may be made hazy, where the haze is visible to birds. The pattern and/or haze may be visible at wavelengths that fall in UV, and minimally noticeable (if at all) in wavelengths within the spectrum visible by humans.

A method of fabrication and device made by preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form one or more angled channels that are then coated.