The present invention relates to an asphalt composition comprising asphalt or an asphalt mixture and to a silicon carbide-containing binder that can be heated by means of microwaves. The silicon carbide is present in the binder in particle form, the equivalent diameter of silicon carbide particles contained in the binder is less than 60 m. The invention also relates to a method for producing and/or renovating road surfaces or asphalt surfaces comprising at least one asphalt surface layer.

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.

Composites made of a cross-linked acrylic polymer and an inorganic aggregate and/or mineral, with the cross-linked acrylic polymer being present at a concentration of 5% to 17%, by weight, are disclosed. Processes of preparing the composites are also disclosed.

A polymeric flexible substrate may be formed from h-BN sheets having a monolayer of hexagonal born nitride interspersed with domains of at least one functionalized material. The functionalized h-BN sheets may be used in various electronic components such as in circuit boards and touch sensors.

Artificial stone having excellent mechanical and weatherability properties is prepared from a highly filled crosslinkable organosilicon composition where the filler comprises at least 20 weight percent of coarse fillers, the organosilicon component contains silicon-bonded alkoxy and or hydroxyl groups, with a catalyst containing a metal compound and an amidine or guanidine.

Artificial stone having excellent mechanical and weatherability properties is prepared from a highly filled crosslinkable organosilicon composition where the filler comprises at least 20 weight percent of coarse fillers, the organosilicon component contains silicon-bonded alkoxy and or hydroxyl groups, with a catalyst containing a metal compound and an amidine or guanidine.

An inorganic dry powder building coating comprises inorganic gel system consisting of alkali metal silicates and hardener, organic re-dispersed emulsoid powder, and may also comprise filler, pigment and auxiliaries. The coating of the present invention has good storage stability, scrub resistance, weather resistance, and is easy to transport. No salting-out and no harmful substances, such as volatile organic compound, benzene, formaldehyde, heavy metal, appear after being solidified to perform film.

An inorganic dry powder building coating comprises inorganic gel system consisting of alkali metal silicates and hardener, organic re-dispersed emulsoid powder, and may also comprise filler, pigment and auxiliaries. The coating of the present invention has good storage stability, scrub resistance, weather resistance, and is easy to transport. No salting-out and no harmful substances, such as volatile organic compound, benzene, formaldehyde, heavy metal, appear after being solidified to perform film.

The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an SiH siloxane); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a di-vinyl functional siloxane). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, including devices having tall structures.

The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an SiH siloxane); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a di-vinyl functional siloxane). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, including devices having tall structures.