A lost circulation material (LCM) composition for sealing lost circulation zones in wellbores may include 50 weight percent to 97 weight percent epoxy resin, 2 weight percent to 30 weight percent curing agent, 0.1 weight percent to 40 weight percent weighting material, and 0.1 weight percent to 20 weight percent amide accelerator. The LCM composition may have a density of greater than or equal to 1121 kilograms per cubic meter and may be capable of being injected through a drill bit of a drill string into the lost circulation zone. The amide accelerator may enable the viscosity of the LCM composition to be reduced while providing a reduced cure time. Methods of treating a lost circulation of a wellbore with the LCM compositions are also disclosed.

A lost circulation material (LCM) composition for sealing lost circulation zones in wellbores may include 50 weight percent to 97 weight percent epoxy resin, 2 weight percent to 30 weight percent curing agent, 0.1 weight percent to 40 weight percent weighting material, and 0.1 weight percent to 20 weight percent amide accelerator. The LCM composition may have a density of greater than or equal to 1121 kilograms per cubic meter and may be capable of being injected through a drill bit of a drill string into the lost circulation zone. The amide accelerator may enable the viscosity of the LCM composition to be reduced while providing a reduced cure time. Methods of treating a lost circulation of a wellbore with the LCM compositions are also disclosed.

Sealing composition for plugging and abandoning a wellbore and methods of plugging and abandoning a wellbore are disclosed. Embodiments of a method for plugging and abandoning a wellbore may include introducing a sealing composition into a wellbore and curing the sealing composition to form a plug. The sealing composition may include from 1 weight percent to 20 weight percent of a curing agent, based on the total weight of the composition, and from 20 weight percent to 97 weight percent of an epoxy resin system, based on the total weight of the composition. The epoxy resin system may include an epoxy resin having the formula (OC.sub.2H.sub.3)—CH.sub.2—O—R.sup.1—O—CH.sub.2—(C.sub.2H.sub.3O), where R.sup.1 is a linear or branched hydrocarbyl having from 4 to 24 carbon atoms; and a reactive diluent having the formula R—O—CH.sub.2—(C.sub.2H.sub.3O), where R is a hydrocarbyl having from 12 to 14 carbon atoms.

Various embodiments disclosed relate to clay stabilizers. In various embodiments, the present invention provides a method of treating a subterranean formation, including obtaining or providing a composition including a clay stabilizer having the structure Y—R.sup.1—(O—R.sup.2).sub.x—Y. The variable R.sup.1 can be a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbylene. At each occurrence, R.sup.2 can independently be a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbylene. At each occurrence, Y can be independently selected from a substituted or unsubstituted amino group, a substituted or unsubstituted ammonium group, a nitro group, a substituted or unsubstituted amine oxide group, and a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbyloxy group, wherein at least one terminal group Y is a substituted amino group, a substituted or unsubstituted ammonium group, a substituted or unsubstituted amine oxide group, or a nitro group. The variable x can be an integer between 1 and 200,000. The method also includes placing the composition in a subterranean formation.

Various embodiments disclosed relate to clay stabilizers. In various embodiments, the present invention provides a method of treating a subterranean formation, including obtaining or providing a composition including a clay stabilizer having the structure Y—R.sup.1—(O—R.sup.2).sub.x—Y. The variable R.sup.1 can be a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbylene. At each occurrence, R.sup.2 can independently be a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbylene. At each occurrence, Y can be independently selected from a substituted or unsubstituted amino group, a substituted or unsubstituted ammonium group, a nitro group, a substituted or unsubstituted amine oxide group, and a substituted or unsubstituted (C.sub.1-C.sub.20)hydrocarbyloxy group, wherein at least one terminal group Y is a substituted amino group, a substituted or unsubstituted ammonium group, a substituted or unsubstituted amine oxide group, or a nitro group. The variable x can be an integer between 1 and 200,000. The method also includes placing the composition in a subterranean formation.

The invention relates to the use of low levels of aliphatic primary and secondary amines to control air void formation in any polymerization reaction having carbonyl groups, and especially carboxylic acid ester group-containing monomers at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The primary or secondary amines are used in the polymerization mixture at levels of 100 to 5000 ppm, based on the carboxylic acid ester group-containing monomer. It is believed the primary and secondary amines hydrogen bond with the —C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methymethacrylate polymers and copolymers, either neat, or as a polymer composite system.

The invention relates to the use of low levels of aliphatic primary and secondary amines to control air void formation in any polymerization reaction having carbonyl groups, and especially carboxylic acid ester group-containing monomers at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The primary or secondary amines are used in the polymerization mixture at levels of 100 to 5000 ppm, based on the carboxylic acid ester group-containing monomer. It is believed the primary and secondary amines hydrogen bond with the —C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methymethacrylate polymers and copolymers, either neat, or as a polymer composite system.

The present invention relates to a new structural class of phenalkamine, phenalkamine curing agent compositions, methods of making such phenalkamine, and methods of making such compositions. The phenalkamine curing agent compositions of the present invention can be prepared by reacting cardanol with an aldehyde compound and a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin.

The present invention relates to a new structural class of phenalkamine, phenalkamine curing agent compositions, methods of making such phenalkamine, and methods of making such compositions. The phenalkamine curing agent compositions of the present invention can be prepared by reacting cardanol with an aldehyde compound and a mixture of methylene bridged poly(cycloaliphatic-aromatic)amines. These curing-agent compositions may be used to cure, harden, and/or crosslink an epoxy resin.

The present invention relates to the use of sacrificial agents to counteract the deleterious impact of gypsum contaminants on the effectiveness of certain stucco additives, particularly, water reducing agents and foaming agents, in a stucco slurry used to make gypsum wallboard.