A method of treating a subterranean formation penetrated by a wellbore, comprising introducing a chemical packer composition into the wellbore, wherein the chemical packer composition comprises water, a suspending agent, a gelling agent, and a sealant composition and wherein the chemical packer composition has a pH greater than 9, and allowing the chemical packer composition to form a plug, wherein a portion of the wellbore below the plug is isolated from fluid communication with a portion of the wellbore above the plug.

A method of treating a subterranean formation penetrated by a wellbore, comprising introducing a chemical packer composition into the wellbore, wherein the chemical packer composition comprises water, a suspending agent, a gelling agent, and a sealant composition and wherein the chemical packer composition has a pH greater than 9, and allowing the chemical packer composition to form a plug, wherein a portion of the wellbore below the plug is isolated from fluid communication with a portion of the wellbore above the plug.

Novel completion fluid compositions for fluid loss control during completion and workover operations conducted on a wellbore penetrating a subterranean formation are disclosed. In particular, the composition is a weighted brine fluid having a polymetaphosphate composition, a biopolymer suspension agent, and a fluid loss control additive. These novel compositions provide a means to temporarily seal a wellbore communicating with a subterranean formation to enable completion or workover operations to be performed, after which the composition can be removed by contact with an acidic composition.

Novel completion fluid compositions for fluid loss control during completion and workover operations conducted on a wellbore penetrating a subterranean formation are disclosed. In particular, the composition is a weighted brine fluid having a polymetaphosphate composition, a biopolymer suspension agent, and a fluid loss control additive. These novel compositions provide a means to temporarily seal a wellbore communicating with a subterranean formation to enable completion or workover operations to be performed, after which the composition can be removed by contact with an acidic composition.

In one aspect, composite polymeric composition and related materials are described herein employing waste products from the agricultural and energy industries. Such composite polymeric compositions and materials can repurpose agricultural and petroleum waste products for various applications including, but not limited to, building and/or infrastructure materials. In some embodiments, a composite polymeric composition described herein comprises polysaccharides, lignin or combinations thereof covalently cross-linked via linkages comprising sulfur.

In one aspect, composite polymeric composition and related materials are described herein employing waste products from the agricultural and energy industries. Such composite polymeric compositions and materials can repurpose agricultural and petroleum waste products for various applications including, but not limited to, building and/or infrastructure materials. In some embodiments, a composite polymeric composition described herein comprises polysaccharides, lignin or combinations thereof covalently cross-linked via linkages comprising sulfur.

In one aspect, composite polymeric composition and related materials are described herein employing waste products from the agricultural and energy industries. Such composite polymeric compositions and materials can repurpose agricultural and petroleum waste products for various applications including, but not limited to, building and/or infrastructure materials. In some embodiments, a composite polymeric composition described herein comprises polysaccharides, lignin or combinations thereof covalently cross-linked via linkages comprising sulfur.

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.

A repair compound for use in all applications and particularly well-suited for large hole repair. The repair compound includes a latex resin, a thickener, fibers, and a filler material. In some embodiments, the repair compound is configured to exhibit pseudoplastic-type behavior. In some embodiments, the repair compound has a density of not greater than 4.0 lbs/gal. In some embodiments, the repair compound includes hydrophobic and hydrophilic fibers of different morphologies. In some embodiments, the repair compound includes HASE-type thickeners. In some embodiments, the repair compound includes a bimodal distribution of hollow glass microspheres from two different strength/size curves.