The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

The present invention relates to a protective layer against CMAS, to a CMAS-resistant article comprising the protective layer according to the invention, and to a process for preparing a corresponding article.

A center flare tip assembly (16) and plenum flare tip assembly (18) with arms (20), having the outside of the center flare tip assembly (16), both inside and outside of the tips (18), the outside of the arms (20), and/or adjacent features of the flare tip (12) are covered with a high emissivity thermal layer (14) with an emissivity greater than 0.85. This reduces flare metal temperatures by thirty percent (30%) or greater, and increases flare life by two (2) to five (5) times current life.

The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.

The present invention relates to a suspension comprising 50-95% by weight of the total suspension (w/w) of at least one metallic material and/or ceramic material and/or polymeric material and/or solid carbon containing material; and at least 5% by weight of the total suspension of one or more fatty acids or derivatives thereof. In addition, the invention relates to uses of such suspension in 3D printing processes.

A heating element and method for fabricating the same includes: a heating material piece configured to generate heat when being powered. A first substrate is configured to support the heating material piece and a liquid guiding member is configured to guide an atomizing liquid to be heated. The first substrate is a substrate made of a dense material and the heating material piece is a film with a certain resistance formed by a resistive slurry fixed on a surface of the dense material substrate by at least one selected from printing, coating, soaking and spraying. Two wires are electrically connected to the first substrate to form electrodes that are respectively connected to two ends of the film with a certain resistance. The liquid guiding member is a member made of a microporous material fixed outside the first substrate and the heating material piece.

One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z.

One embodiment of the disclosure provides a method of fabricating a chamber component with a coating layer disposed on an interface layer with desired film properties. In one embodiment, a method of fabricating a coating material includes providing a base structure comprising an aluminum or silicon containing material, forming an interface layer on the base structure, wherein the interface layer comprises one or more elements from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and forming a coating layer on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z. In another embodiment, a chamber component includes an interface layer disposed on a base structure, wherein the interface layer is selected from at least one of Ta, Al, Si, Mg, Y, or combinations thereof, and a coating layer disposed on the interface layer, wherein the coating layer has a molecular structure of Si.sub.vY.sub.wMg.sub.xAl.sub.yO.sub.z.

A method for producing an electrically-conductive pellet includes reducing a size of a first material. The method also includes wetting the first material to produce a first slurry. The method also includes introducing the first slurry into a fluidizer to produce a first pellet. The method also includes reducing a size of a second material. The second material is an electrically-conductive material. The method also includes wetting the second material to produce a second slurry. The method also includes applying the second slurry to the first pellet.

An environmental barrier coating, comprising a substrate containing silicon; an environmental barrier layer applied to the substrate; the environmental barrier layer comprising an oxide matrix; an oxidant getter phase interspersed throughout the oxide matrix; and a self-healing phase interspersed throughout the oxide matrix.