Patent classifications
C04B35/453
Ceramic Composite Materials
Composite ceramic materials are disclosed in which an interconnected network of ceramic material on a substrate contains pores with an accessible pore volume that is at least partially filled with a polymer, resin, and/or wax.
Ceramic Composite Materials
Composite ceramic materials are disclosed in which an interconnected network of ceramic material on a substrate contains pores with an accessible pore volume that is at least partially filled with a polymer, resin, and/or wax.
Selectively Applied Gradient Coating Compositions
Surface modifications and coating materials are provided that may be applied to a substrate to reduce or eliminate damage that would accrue to do environmental effects or operational stress when incorporated into a device such as a heat exchanger. Structured ceramic surface modification materials may be incorporated into the surface modification and may optionally include a gradient in one or more physical or chemical property.
Assemblies of Functionalized Textile Materials and Methods of Use Thereof
Assemblies of stacked layers of materials are described. The assemblies include functional and structural layers. Functional layers include binderless ceramic materials on woven or non-woven substrates of natural, synthetic, or metallic materials. The layers of functional and structural materials may be configured to transport moisture or heat from an inner surface to an outer surface that is exposed to an ambient environment.
Sputtering target, oxide semiconductor thin film, and method for producing oxide semiconductor thin film
A sputtering target including an oxide that includes an indium element (In), a tin element (Sn), a zinc element (Zn) and an aluminum element (Al), and including a homologous structure compound represented by InAlO.sub.3(ZnO).sub.m (m is 0.1 to 10), wherein the atomic ratio of the indium element, the tin element, the zinc element and the aluminum element satisfies specific requirements.
Sputtering target, oxide semiconductor thin film, and method for producing oxide semiconductor thin film
A sputtering target including an oxide that includes an indium element (In), a tin element (Sn), a zinc element (Zn) and an aluminum element (Al), and including a homologous structure compound represented by InAlO.sub.3(ZnO).sub.m (m is 0.1 to 10), wherein the atomic ratio of the indium element, the tin element, the zinc element and the aluminum element satisfies specific requirements.
Sputtering target, oxide semiconductor thin film, and method for producing these
A sputtering target including an oxide that includes an indium (In) element, a tin (Sn) element, a zinc (Zn) element and an aluminum (Al) element, wherein the oxide includes a homologous structure compound represented by InAlO.sub.3(ZnO).sub.m (m is 0.1 to 10) and a bixbyite structure compound represented by In.sub.2O.sub.3.
Sputtering target, oxide semiconductor thin film, and method for producing these
A sputtering target including an oxide that includes an indium (In) element, a tin (Sn) element, a zinc (Zn) element and an aluminum (Al) element, wherein the oxide includes a homologous structure compound represented by InAlO.sub.3(ZnO).sub.m (m is 0.1 to 10) and a bixbyite structure compound represented by In.sub.2O.sub.3.
ADDITIVE MANUFACTURING POWDERS WITH IMPROVED PHYSICAL CHARACTERISTICS, METHOD OF MANUFACTURE AND USE THEREOF
In additive manufacturing operations, powders used in stereolithographic processes need to be precisely spread out in a uniform fashion at every pass of the stereolithographic process to ensure predictability in powder surface morphology. Typically, this is difficult to achieve with conventional powders because often these powders suffer from poor flowability, which may further deteriorate over time, and impairs the efficiency of the stereolithographic processes. The present disclosure describes additive manufacturing powders having improved physical characteristics such as flowability and tap density, which are less sensitive or insensitive to ambient humidity. For example, there is described a powder that includes spherical particles having a particle size distribution of less than 1000 micrometers and having a measurable flowability as determined in accordance with ASTM B213 at 75% relative humidity.
Sintered body
A sintered body, containing zinc, magnesium and oxygen as constituent elements, wherein the atomic ratio of zinc to the sum of zinc and magnesium [Zn/(Zn+Mg)] is 0.20 to 0.75, the atomic ratio of magnesium to the sum of zinc and magnesium [Mg/(Zn+Mg)] is 0.25 to 0.80, and the sintered body consists of a single crystal structure as measured by X-ray diffraction.