Patent classifications
C04B35/64
DYNAMIC COVALENT POLYMERIZATIONS WITH ELEMENTAL SULFUR AND SULFUR PREPOLYMERS
An iterative approach to dynamic covalent polymerizations of elemental sulfur with functional comonomers to prepare sulfur prepolymers that can further react with other conventional, commercially available comonomers to prepare a wider class of functional sulfur polymers. This iterative method improves handling, miscibility and solubility of the elemental sulfur, and further enables tuning of the sulfur polymer composition. The sulfur polymers may be a thermoplastic or a thermoset for use in elastomers, resins, lubricants, coatings, antioxidants, cathode materials for electrochemical cells, and polymeric articles such as polymeric films and free-standing substrates.
DYNAMIC COVALENT POLYMERIZATIONS WITH ELEMENTAL SULFUR AND SULFUR PREPOLYMERS
An iterative approach to dynamic covalent polymerizations of elemental sulfur with functional comonomers to prepare sulfur prepolymers that can further react with other conventional, commercially available comonomers to prepare a wider class of functional sulfur polymers. This iterative method improves handling, miscibility and solubility of the elemental sulfur, and further enables tuning of the sulfur polymer composition. The sulfur polymers may be a thermoplastic or a thermoset for use in elastomers, resins, lubricants, coatings, antioxidants, cathode materials for electrochemical cells, and polymeric articles such as polymeric films and free-standing substrates.
METHODS FOR MANUFACTURING SILICON NITRIDE MATERIALS
The present disclosure relates to the manufacture of silicon nitride implants with increased surface roughness and porosity.
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
Provided is a dielectric composition containing: a main component expressed by {Ba.sub.xSr.sub.(1-x)}.sub.mTa.sub.4O.sub.12; and a first subcomponent, m satisfying a relationship of 1.95≤m≤2.40. The first subcomponent includes silicon and manganese. When the amount of the main component contained in the dielectric composition is set to 100 parts by mole, the amount of silicon contained in the dielectric composition is 5.0 to 20.0 parts by mole in terms of SiO.sub.2, and the amount of manganese contained in the dielectric composition is 1.0 to 4.5 parts by mole in terms of MnO.
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
Provided is a dielectric composition containing: a main component expressed by {Ba.sub.xSr.sub.(1-x)}.sub.mTa.sub.4O.sub.12; and a first subcomponent, m satisfying a relationship of 1.95≤m≤2.40. The first subcomponent includes silicon and manganese. When the amount of the main component contained in the dielectric composition is set to 100 parts by mole, the amount of silicon contained in the dielectric composition is 5.0 to 20.0 parts by mole in terms of SiO.sub.2, and the amount of manganese contained in the dielectric composition is 1.0 to 4.5 parts by mole in terms of MnO.
POLYMER-DERIVED CERAMIC FIBERS AND METHODS OF PREPARING THE SAME
Ceramic matrix composite (CMC) materials are a desired solution for lightweight and high temperature applications. CMC materials can be reinforced with polymer-derived ceramic (PDC) fibers, which advantageously possess intrinsic thermal stability and high mechanical strength. Carbon-rich SiOC and SiOCN fibers were synthesized via hand-drawing and electrospinning polymer pyrolysis of a hybrid precursor materials with the aid of a spinning reagent. The prepared fibers are crosslinked and pyrolyzed for polymer-to-ceramic conversion.
POLYMER-DERIVED CERAMIC FIBERS AND METHODS OF PREPARING THE SAME
Ceramic matrix composite (CMC) materials are a desired solution for lightweight and high temperature applications. CMC materials can be reinforced with polymer-derived ceramic (PDC) fibers, which advantageously possess intrinsic thermal stability and high mechanical strength. Carbon-rich SiOC and SiOCN fibers were synthesized via hand-drawing and electrospinning polymer pyrolysis of a hybrid precursor materials with the aid of a spinning reagent. The prepared fibers are crosslinked and pyrolyzed for polymer-to-ceramic conversion.
CERAMIC ELECTRONIC COMPONENT
A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABO.sub.3 as a main phase, and includes a region in which Dy is solid solubilized. In the region in which the Dy is solid solubilized, an X-ray count of Dy solid-solubilized in an A-site of the perovskite structure measured by using Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy (STEM-EDS) is AD, an X-ray count of Dy solid-solubilized in a B-site of the perovskite structure is BD, and an average value of AD/BD is 1.6 or more and 2.0 or less.
CERAMIC ELECTRONIC COMPONENT
A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer has a perovskite structure represented by a general formula ABO.sub.3 as a main phase, and includes a region in which Dy is solid solubilized. In the region in which the Dy is solid solubilized, an X-ray count of Dy solid-solubilized in an A-site of the perovskite structure measured by using Scanning Transmission Electron Microscopy-Energy Dispersive X-ray Spectroscopy (STEM-EDS) is AD, an X-ray count of Dy solid-solubilized in a B-site of the perovskite structure is BD, and an average value of AD/BD is 1.6 or more and 2.0 or less.
Method for producing a hollow part made of a ceramic matrix composite material
A method for producing a hollow part made of a ceramic matrix composite material. The method includes shaping a hollow fibrous preform. A core of oxidizable material is housed or inserted into the preform. The method also includes consolidating the preform and extracting the core by oxidising the core.