A method for forming a ceramic matrix composite (CMC) component with an internal cooling channel includes forming a first fiber member, forming a first depression in a surface of the first fiber member, covering the first depression with a second fiber member to form a near-net shape fiber preform of a component with an internal channel defined in part by the first depression, and densifying the fiber preform.

A method for manufacturing a sensor element that includes: a pair of electrodes; a ceramic layer having a hollow space that is to be an air introduction hole; and a first layer and a second layer stacked at both surfaces of the ceramic layer, One of the electrodes is in communication with the hollow space, The method includes: preparing an unsintered ceramic sheet, and a burn-out material sheet having a thickness different from that of the unsintered ceramic sheet, the burn-out material sheet having, in a plane orthogonal to the direction of an axial line O, a cross-sectional area substantially identical to a cross-sectional area of the pre-sintering hollow space; placing the burn-out material sheet in the pre-sintering hollow space; pressing the sheets so as to have an identical thickness; and burning out the burn-out material sheet.

Ceramic composite materials that are reinforced with carbide fibers can exhibit ultra-high temperature resistance. For example, such materials may exhibit very low creep at temperatures of up to 2700 F. (1480 C.). The present composites are specifically engineered to exhibit matched thermodynamically stable crystalline phases between the materials included within the composite. In other words, the reinforcing fibers, a debonding interface layer disposed over the reinforcing fibers, and the matrix material of the composite may all be of the same crystalline structural phase (all hexagonal), for increased compatibility and improved properties. Such composite materials may be used in numerous applications.

A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 m.

A honeycomb structure including a plurality of porous honeycomb block bodies bound via joining material layers A. Each of the porous honeycomb block bodies includes a plurality of porous honeycomb segments bound via joining material layers B, each of the porous honeycomb segment includes: partition walls that defines a plurality of cells to form flow paths for a fluid, each of cells extending from an inflow end face that is an end face on a fluid inflow side to an outflow end face that is an end face on a fluid outflow side; and an outer peripheral wall located at the outermost periphery. At least a part of the joining material layers A has higher toughness than that of the joining material layers B.

A honeycomb structure includes a plurality of prismatic columnar shaped honeycomb segments; a bonding layer bonding side faces of the honeycomb segments; and a circumferential wall disposed to surround a honeycomb segment bonded body having the honeycomb segments arranged in a grid pattern and bonded with the bonding layer, wherein the honeycomb segments has a porous partition wall disposed to surround a plurality of cells, the cells in other than outermost circumference have a hexagonal shape in a section orthogonal to the cell extending direction, the honeycomb segments include first and second honeycomb segment, the second honeycomb segment is different from the first in at least one of: a shape in the section; a size; and an arrangement direction of the cells and an extended line of one diagonal line imaginarily depicted in the cells in the first honeycomb segment and that in the second are configured to be orthogonal.

A turbine engine component may comprise a Ceramic Matrix Composite (CMC) structure including a plurality of nominally dense plies, wherein each of the plurality of the nominally dense plies are bonded by at least one of a Field Assisted Sintering Technique (FAST), a Spark Plasma Sintering (SPS), or a localized heating at a bonding interface. The turbine engine component may include an airfoil extending between a first platform and a second platform, wherein the airfoil, the first platform, and the second platform define the CMC structure.

A wavelength conversion member complex includes a wavelength conversion member, a joining material, and a heat dissipation member. The wavelength conversion member includes a support and a phosphor member. The support defines a through-hole extending from an upper surface to a lower surface. The support has a concave portion on the lower surface around the through-hole. The concave portion is spaced apart from the through-hole. The phosphor member is disposed in the through-hole and includes a phosphor. The lower surface of the phosphor member is continuous with the lower surface of the support. The joining material is disposed in the concave portion, and has a lower surface that is flush with the lower surface of the support. The heat dissipation member is disposed under the joining material and the phosphor member, and has an upper surface in contact with the lower surface of the joining material.

The present invention discloses a polyimide-based composite carbon film with high thermal conductivity and a preparation method therefor. The preparation method includes: uniformly coating the surface of a polyimide-based carbon film with an aqueous graphene oxide solution, and then covering the same with another polyimide-based carbon film uniformly coated with an aqueous graphene oxide solution; repeating such operation; after the polyimide-based carbon films are dried, bonding the polyimide-based carbon films by means of graphene oxide so as to form a thick film; bonding the polyimide-based carbon films more tightly by means of further low-temperature hot pressing; and finally, obtaining a thick polyimide-based carbon film with high thermal conductivity by repairing defects by means of low-temperature heating pre-reduction and high-temperature and high-pressure thermal treatment. The thick polyimide-based carbon film with high thermal conductivity has a thickness greater than 100 m and an in-plane thermal conductivity of even reaching 1700 W/mK or above.

A semiconductor manufacturing device member according to the present invention includes a ceramic disc with an internal electrode and a ceramic shaft that supports the disc. The disc and the shaft are integrated without having a bonding interface.