C04B37/006

Method for making a high temperature resistant silicon alloy joint for the joining of ceramics and devices using same

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with a silicon and an alloying element under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck.

Ceramic matrix composite component and method of producing the same

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

Active metal braze joint with stress relieving layer
10363624 · 2019-07-30 · ·

The present disclosure relates to a brazed superabrasive assemblies and method of producing brazed superabrasive assemblies. The brazed superabrasive assemblies may include a plurality of braze alloy layers that are positioned opposite a stress relieving layer. The stress relieving layer may have a solidus temperature that is greater than a solidus temperature of the plurality of braze alloy layers.

NANOMATERIAL ASSISTED BONDING METHOD TO PRODUCE CURVED SURFACES
20190217592 · 2019-07-18 ·

A method of fabricating a curved surface bonding technique using low melting temperature nanoparticles or nanofilms/nanoparticles of reactive metals as eutectic compounds. The ability of nanomaterials to melt at low temperature lowers the bonding temperature and reduces/eliminates the residual stresses generated in bulk material during the bonding process of two materials with different coefficients of thermal expansion. The nanoscale materials will then be integrated and the new bond will assume properties of the bulk material, including its higher melting temperature.

Polycrystalline diamond compacts including at least one transition layer and methods for stress management in polycrystalline diamond compacts

Embodiments relate to polycrystalline diamond compacts (PDCs) that are less susceptible to liquid metal embrittlement damage due to the use of at least one transition layer between a polycrystalline diamond (PCD) layer and a substrate. In an embodiment, a PDC includes a PCD layer, a cemented carbide substrate, and at least one transition layer bonded to the substrate and the PCD layer. The at least one transition layer is formulated with a coefficient of thermal expansion (CTE) that is less than a CTE of the substrate and greater than a CTE of the PCD layer. At least a portion of the PCD layer includes diamond grains defining interstitial regions and a metal-solvent catalyst occupying at least a portion of the interstitial regions. The diamond grains and the catalyst collectively exhibit a coercivity of about 115 Oersteds or more and a specific magnetic saturation of about 15 Gauss.Math.cm.sup.3/grams or less.

Ceramic pressure measurement cell and method for production thereof
10330549 · 2019-06-25 · ·

A pressure measurement cell, comprising: a ceramic measurement membrane and a ceramic counterpart. The measurement membrane is joined to the counterpart in a pressure-tight manner forming a pressure chamber between the measurement membrane and the counterpart by means of an active brazing solder. The pressure measurement cell furthermore has a solder stop layer on a surface of the measurement membrane and/or the counterpart, wherein the solder stop layer has a metal oxide or a reduced form of the metal oxide. The metal oxide has at least one oxidation stage, which, assuming an activity coefficient of R.sub.akt=1 at an inverse temperature of 8.Math.10.sup.4/K, has an oxygen coexistence decomposition pressure of not less than 1.sup.23 MPa (10.sup.23.Math. bar) and not more than 1.sup.12 MPa (10.sup.12.Math. bar) and which, assuming an activity coefficient of R.sub.akt=1, at an inverse temperature of 9.Math.10.sup.4/K has an oxygen coexistence decomposition pressure of not less than 1.sup.27 MPa (10.sup.27 bar) and not more than 1.sup.15 MPa (10.sup.15 bar). Suitable metal oxides are, for example, oxides of chromium, tungsten or titanium.

Method and substrates for making photovoltaic cells
10333014 · 2019-06-25 ·

Methods of and apparatuses for making a photovoltaic cell are provided. The photovoltaic cell is able to have a substrate made of a composite material. The composite material is able to be formed by mixing a binder and a physical property enhancing material to form a mixer. The binder is able to be pitch, such as mesophase pitch. The physical property enhancing material is able to be fiber glass. The substrate of the photovoltaic cell is able to be flexible, such that the photovoltaic cell is able to be applied on various surfaces.

BONDING METHOD FOR COPPER-COPPER METAL
20240222314 · 2024-07-04 · ·

The present disclosure belongs to the technical field of three-dimensional packaging, and in particular relates to a bonding method for a copper-copper metal. The bonding method includes: subjecting a copper-plated surface of a clean copper-plated substrate to pretreatment with hydrazine hydrate under a protective atmosphere, to obtain a copper-plated substrate to be bonded, where the copper-plated surface is kept at 50? C. to 90? C.; and subjecting a plurality of the copper-plated substrates to be bonded to pressurized bonding at 200? ? C. to 300? ? C. under the protective atmosphere.

Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devices

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

System and Method for Producing Chemicals at High Temperature

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.