C04B37/006

High density corrosion resistant layer arrangement for electrostatic chucks
12125732 · 2024-10-22 · ·

A layer arrangement for an electrostatic chuck comprises a first ceramic layer; a second ceramic layer; a metallised layered disposed between the first and second ceramic layers. The first ceramic layer comprises at least 90.0 wt % alumina, titania, ZrO.sub.2, Y.sub.2O.sub.3, AlN, Si.sub.3N.sub.4, SiC, transition metal oxides or combinations thereof; and in the range of 0.1 to 10.0 wt % tantalum oxide (Ta.sub.2O.sub.5).

METHOD FOR JOINING AT LEAST TWO COMPONENTS
20180190610 · 2018-07-05 ·

The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.

Ceramic to ceramic joining method
10000422 · 2018-06-19 · ·

The present invention provides a ceramic to ceramic joint and methods for making such a joint. Generally, the joint includes a first ceramic part and a second ceramic part, wherein the first and second ceramic parts each include a ceramic-carbide or a ceramic-nitride material. In some cases, an aluminum-initiated joint region joins the first and second ceramic parts. This joint region typically includes chemical species from the first and second ceramic parts that have diffused into the joint region. Additionally, the first and second ceramic parts each typically include a joint diffusion zone that is disposed adjacent to the joint region and which includes aluminum species from the joint region that have diffused into the joint diffusion zone. Other implementations are also described.

Method for repairing heaters and chucks used in semiconductor processing

A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

METHOD AND SUBSTRATES FOR MATERIAL APPLICATION
20180158972 · 2018-06-07 ·

A method of and an apparatus for making a composite material is provided. The composite is able to be formed by mixing a binder and a physical property enhancing material to form a mixer. The binder is able to be pitch, such as mesophase pitch. The physical property enhancing material is able to be fiber glass. The mixer is able to be processed through a lamination process, stabilization/cross-link process, and carbonization. The composite material is able to be applied in the field of electronic components and green technology, such as a substrate of a photovoltaic cell.

High temperature seal compositions and methods of using same

The disclosure relates to sealant compositions for forming hermetic seals, methods of use, and hermetically sealed products. The sealant compositions comprise a first inorganic oxide chosen from at least one of MgSiO.sub.3, MgO, MgTiO.sub.3, CaO, and CaSiO.sub.3, a second inorganic oxide chosen from SiO.sub.2, at least one solvent, and optionally at least one organic resin binder.

GAS-TIGHT, HEAT-PERMEABLE MULTILAYER CERAMIC COMPOSITE TUBE

The present invention relates to a gastight multilayer composite tube having a heat transfer coefficient of >500 W/m.sup.2/K and comprising at least two layers, namely a layer of nonporous monolithic oxide ceramic and a layer of oxidic fiber composite ceramic, a connecting piece comprising at least one metallic gas-conducting conduit which in the longitudinal direction of the composite tube overlaps in a region at least two ceramic layers, where the one ceramic layer comprises a nonporous monolithic ceramic and the other ceramic layer comprises a fiber composite ceramic, and also the use of the multilayer composite tube as reaction tube for endothermic reactions, radiation tubes, flame tubes or rotary tubes.

Method for Joining Ceramics to Ceramics or Ceramics to Metals, and Apparatus

An assembly including a ceramic body. The assembly comprises a tungsten coupling attached to the ceramic body with a first joint that forms a first helium tight seal between the ceramic body and the tungsten coupling and where the first helium tight seal maintains its integrity at a temperature over 400 C. The assembly includes a metal body attached to the tungsten coupling with a second joint that forms a second helium tight seal between the metal body and the tungsten coupling and where the second helium tight seal maintains its integrity at a temperature over 400 C. A method. A mixture. A coupling.

MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR PRODUCING THE SAME
20180108556 · 2018-04-19 · ·

A method for producing a member for a semiconductor manufacturing apparatus 10 includes (a) a step of providing an electrostatic chuck 20, a supporting substrate 30, and a metal bonding material 401, the electrostatic chuck being made of a ceramic and having a form of a flat plate, the supporting substrate including a composite material having a difference in linear thermal expansion coefficient at 40 to 570 C. from the ceramic of 0.210.sup.6/K or less in absolute value, and (b) a step of interposing the metal bonding material 401 between a concave face 32 of the supporting substrate 30 and a face 23 of the electrostatic chuck 20 opposite to a wafer mounting face 22, and thermocompression bonding the supporting substrate 30 and the electrostatic chuck 20 at a predetermined temperature to deform the electrostatic chuck 20 to the shape of the concave face 32.

Interconnector material, intercellular separation structure, and solid electrolyte fuel cell

Provided is an interconnector material which is chemically stable in both oxidation atmospheres and reduction atmospheres, has a high electron conductivity (electric conductivity), a low ionic conductivity, does not contain Cr, and enables a reduction in sintering temperature. The interconnector material is arranged between a plurality of cells each composed of an anode layer, a solid electrolyte layer, and a cathode layer stacked sequentially, and electrically connects the plurality of cells to each other in series in a solid electrolyte fuel cell. The interconnector is formed of a ceramic composition represented by the composition formula La(Fe.sub.1-xAl.sub.x)O.sub.3 in which 0<x<0.5.