A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

Laminates and antenna-in-packaging include a plurality of substrates and a plurality of metallic traces disposed between adjacent pairs of substrates and extending through one or more vias in at least one substrate. An adjacent pair of metallic traces electrically connected through the one or more vias. The adjacent pair of substrates are bonded together by at least the metallic trace positioned therebetween. A metallic material of the plurality of metallic traces has an electrical conductivity at 20 C. of about 10.sup.5 S/m or more. Methods include disposing a first metallic trace on a first substrate followed by disposing a second substrate thereon and then disposing a second metallic traces thereon before heating the resulting assembly to form the laminate with the substrates bonded together by at least the metallic trace. Disposing the metallic trace can include disposing a conductive ink, for example, by aerosol jet printing.

A preparation method for a copper plate-covered silicon nitride ceramic substrate is provided. The structure of the copper plate-covered silicon nitride ceramic substrate includes a silicon nitride ceramic substrate, copper sheets disposed on the upper and lower sides of the silicon nitride ceramic substrate and soldering layers disposed between the copper sheets and the silicon nitride ceramic substrate; the composition of the silicon nitride ceramic substrate comprises a silicon nitride phase (more than or equal to 95 wt %); and a grain boundary phase (containing at least three elements (Y, Mg and O) and less than or equal to 5 wt %, and the content of a crystalline phase in the grain boundary phase is more than or equal to 40 vol %); and the sintering aids are Y.sub.2O.sub.3 and MgO. The two-step sintering process comprises: in a nitrogen atmosphere, performing low-temperature heat treatment and high-temperature heat treatment in sequence.

A joining method includes placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly and placing the components of said joining pre-assembly into a process chamber. Oxygen is removed from said process chamber and at least said brazing element of said joining pre-assembly is heated, thereby hermetically joining said first ceramic piece to said second ceramic piece. Said brazing element consists of Cobalt and Carbon.

A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

A method for limiting void formation in a melt-infiltrated ceramic matrix composite (MI-CMC) component includes arranging one or more infiltrant feedstocks in fluid communication with a targeted area of the MI-CMC component. The one or more infiltrant feedstocks have a nominal melting point at or below a nominal melting point of an alloy within the MI-CMC component. The method includes heating the one or more infiltrant feedstocks to a first temperature at or above the nominal melting point of the one or more infiltrant feedstocks to form a molten phase. The method also includes infiltrating the targeted area of the MI-CMC component with the molten phase. As such, the molten phase reacts with a solid phase in the targeted area of the MI-CMC component. Further, the method includes cooling the MI-CMC component to a second temperature that is below the first temperature to solidify the molten phase.

A container comprising: a container body that includes a wall portion separating inside and outside and is formed of a long-fiber-reinforced silicon-carbide composite material obtained by combining monofilaments of silicon carbide with a silicon carbide matrix, the wall portion having a thickness equal to a specific dimension; and a lid configured to close an opening of the container body, formed of a material containing at least silicon carbide, and equipped with such a wall portion separating inside and outside that thickness is within a range of 1 to 3 times the specific dimension.

An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

A cutting tool includes a supporting body and a cBN or PCD cutting edge tip attached to the supporting body via a 5-150 m braze joint. The supporting body is cemented carbide having 3-25 wt % of a metallic binder, optionally up to 25 wt % of carbides or carbonitrides of one or more elements of group 4, 5, or 6, and the rest WC. The metallic binder includes at least 40 wt % Ni, and the braze joint has, in the order from the supporting body, a first layer of TiC situated next thereto, with an average thickness of 10-400 nm, a second layer, with an average thickness of 0.5-8 m, having in average at least 5 wt % metallic Ni, in average 25-60 wt % metallic Cu and in average 15-45 wt % metallic Ti, and a third layer, with an average thickness of 4-145 m, having metallic Ag and metallic Cu.