C04B37/023

MODULE
20190116687 · 2019-04-18 ·

The present invention relates to a module (1) which comprises a power semiconductor device (2) and a ceramic capacitor (3) which is configured for cooling the power semiconductor device (2).

Multilayer component and process for producing a multilayer component
10262778 · 2019-04-16 · ·

A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment the multilayer component includes a ceramic main element being a varistor ceramic and at least one metal structure, wherein the metal structure is cosintered, and wherein the main element is doped with a material of the metal structure in such a way that a diffusion of the material from the metal structure into the main element during a sintering operation is reduced.

METHODS FOR REPAIRING COMPOSITE CYLINDERS

Methods for repairing composite cylindrical components are provided. One exemplary method for repairing a cylindrical component defining an axial direction, a radial direction, and a circumferential direction includes removing a damaged region of the cylindrical component. A flange extending from a cylindrical body of the cylindrical component is included in the damaged region. One or more arc segments that extend along the circumferential direction are connected with the existing cylindrical component. At least one of the arc segments includes a prefabricated flange. One or more plies are laid up to connect the arc segments with the existing cylindrical component to repair the damaged region of the cylindrical body and the prefabricated flange formed integrally with one of the arc segments replaces the damaged portion of the flange. Repaired cylindrical components are also provided.

METHOD OF MAKING A SHAPED TOOL COMPONENT
20240239714 · 2024-07-18 ·

This disclosure relates to a method of making a polycrystalline diamond (PCD) body comprising a PCD table with a height of at least 10 mm.

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum oxide, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is provided on a ceramic member side of an interface between the copper member and the ceramic member; and a Mg solid solution layer is provided between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase.

Bonded body, insulated circuit board with heat sink, and heat sink

A bonded body includes an aluminum member made of an aluminum alloy and a copper member made of copper or a copper alloy, in which the aluminum member is made of an AlMn-based alloy containing Mn, an Mn concentration C.sub.0 of the entire aluminum member is in a range of 0.4 mass % or more and 1.5 mass % or less, and, when an Mn concentration in a region excluding a precipitate in the aluminum member is defined as an Mn solid solution concentration C.sub.1 and a value obtained by subtracting the Mn solid solution concentration C.sub.1 from the Mn concentration C.sub.0 of the entire aluminum member is defined as an Mn precipitate concentration C.sub.2, a ratio C.sub.1/C.sub.2 of the Mn solid solution concentration C.sub.1 to the Mn precipitate concentration C.sub.2 is in a range of 0.1 or more and 2.7 or less.

COMPOSITION AND METHOD OF PRODUCING BONDED BODY

Selected is a composition containing a silver powder generating gaseous carbon dioxide, acetone vapor, and water vapor in a case where the silver powder is heated at 100 C., a stress relaxation body having a Young's modulus lower than a Young's modulus of a sintered body of the silver powder, and a solvent, in which a particle size distribution of primary particles of the silver powder has a first peak in a range of a particle size of 20 to 70 nm and a second peak in a range of a particle size of 200 to 500 nm, an organic substance in the silver powder is decomposed by 50% by mass or more at 150 C., and a mass ratio between the silver powder and the stress relaxation body is 99:1 to 60:40.

Brazeable Zirconia Ceramics, Methods Of Brazing Zirconia Ceramics, And Brazed Zirconia Ceramics
20190031571 · 2019-01-31 ·

A method of brazing a sintered zirconia ceramic body, comprises: providing a sintered zirconia ceramic body having a surface; chemically reducing the sintered zirconia ceramic body in whole or in part to form a reduced surface to the sintered zirconia ceramic body; applying a brazing material to at least part of the reduced surface to form an assembly comprising said brazing material and sintered zirconia ceramic body; heating said assembly to a temperature sufficient to at least partially melt the brazing material such that the brazing material wets the reduced surface; and cooling the assembly to solidify the brazing material.

APPARATUS INCLUDING A CERAMIC COMPONENT, A METAL COMPONENT, AND A GLASS SEALING MATERIAL AND A PROCESS OF FORMING THE APPARATUS

An apparatus can include a ceramic component, a metal component, and a glass sealing material that bonds the ceramic and metal components to each other. In an embodiment, the coefficients of thermal expansion of the components and glass sealing material can be within 4 ppm/ C. of one another. The metal component may be relatively oxidation resistant. The glass sealing material may have a relatively low amount of an amorphous phase as compared to one or more crystalline phases within the glass sealing material. The apparatuses can exhibit good bond strength even after long term exposure to high temperature, thermal cycling to a high temperature, or both. In an embodiment, the metal component may allow another metal component of a different composition to be used without a significant impact on the integrity of the bonded apparatus.

THICK-FILM PASTE MEDIATED CERAMICS BONDED WITH METAL OR METAL HYBRID FOILS

Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.