The present disclosure relates to a brazed superabrasive assemblies and method of producing brazed superabrasive assemblies. The brazed superabrasive assemblies may include a plurality of braze alloy layers that are positioned opposite a stress relieving layer. The stress relieving layer may have a solidus temperature that is greater than a solidus temperature of the plurality of braze alloy layers.

A method for attaching an insert to a substrate includes: rubbing the insert against the substrate; forming a heat-affected zone in the substrate; forming plasticized substrate material from friction resulting from the rubbing; moving the insert to a first depth in the heat-affected zone in the substrate; moving the insert to a second depth in the heat-affected zone in the substrate where the first depth is deeper than the second depth; flowing the plasticized material against the insert; and releasing the insert.

An improved ceramic material for heat insulation with selection of specific stabilizers and adapted proportions, includes zirconium oxide with 0.2 wt. % to 8.0 wt. % of the base stabilizers: yttrium oxide (Y.sub.2O.sub.3), hafnium oxide (HfO.sub.2), cerium oxide (CeO.sub.2), calcium oxide (CaO), and/or magnesium oxide (MgO), wherein at least yttrium oxide (Y.sub.2O.sub.3) is used, and optionally at least one of the additional stabilizers: 0.2 wt. % to 20 wt. % of erbium oxide (Er.sub.2O.sub.3) and/or ytterbium oxide (Yb.sub.2O.sub.3).

According to one embodiment, when a DSC curve is measured using a differential scanning calorimeter (DSC) for a brazing material for bonding a ceramic substrate and a metal plate, the brazing material has an endothermic peak within a range of not less than 550 C. and not more than 700 C. in a heating process. The brazing material favorably includes Ag, Cu, and Ti. The brazing material favorably has not less than two of the endothermic peaks within a range of not less than 550 C. and not more than 650 C. in the heating process.

A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

The present application provides a multi-surface airtight packaging ceramic shell, a multi-surface packaging device, and preparation method, belonging to the field of ceramic packaging technology. The multi-surface airtight packaging ceramic shell includes: a ceramic body, a shape of which is a polyhedron; where at least one surface of the ceramic body is provided with a shared solder pad, remaining surfaces other than the at least one surface having the shared solder pad are provided with sealing rings, and a packaging cavity for packaging a chip is formed inside each sealing ring. The ceramic body provided in the present application is a polyhedron, with one surface of shared solder pad as the bottom surface, and the other surfaces having chip mounting areas, bonding areas, and sealing rings.

A copper-ceramic bonded body includes a copper member made of copper or a copper alloy, and a ceramic member made of silicon nitride, the copper member and the ceramic member being bonded to each other, in which a maximum length of a MgN compound phase which is present at a bonded interface between the copper member and the ceramic member is less than 100 nm, and in a unit length along the bonded interface, the number density of the MgN compound phase in a range of a length of 10 nm or more and less than 100 nm is less than 8 pieces/m.

The present application provides a multi-surface airtight packaging ceramic shell, a multi-surface packaging device, and preparation method, belonging to the field of ceramic packaging technology. The multi-surface airtight packaging ceramic shell includes: a ceramic body, a shape of which is a polyhedron; where at least one surface of the ceramic body is provided with a shared solder pad, remaining surfaces other than the at least one surface having the shared solder pad are provided with sealing rings, and a packaging cavity for packaging a chip is formed inside each sealing ring. The ceramic body provided in the present application is a polyhedron, with one surface of shared solder pad as the bottom surface, and the other surfaces having chip mounting areas, bonding areas, and sealing rings.

The invention relates to a process for producing a metal-ceramic substrate (1), comprising: providing a ceramic element (10), a metal ply (40) and at least one metal layer (30), forming an ensemble (18) of the ceramic element (10), the metal ply (40) and the at least one metal layer (30), forming a gas-tight container (30) surrounding the ceramic element (10), wherein the at least one metal layer (30) is arranged between the ceramic element (10) and the metal ply (40) in the container, andforming the metal-ceramic substrate (1) by hot isostatic pressing.

Novel methods of preparing a metal bonded substrate. A method may include providing a ceramic substrate, the ceramic substrate comprising a ceramic body. The method may include bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding.