A heater includes an aluminum nitride (AlN) substrate and a heating layer. The heating layer is made from a molybdenum material and is bonded to the AlN substrate via transient liquid phase bonding. The heater can also include a routing layer and a plurality of first conductive vias connecting the heating layer to the routing layer. The routing layer and the plurality of first conductive vias can be made from the molybdenum material and at least one of the routing layer and the plurality of first conductive vias are bonded to the AlN substrate via a transient liquid phase bond. A plurality of second conductive vias connecting the routing layer to a surface of the AlN substrate can be included and the plurality of second conductive vias are made of the molybdenum material and can be bonded to the AlN substrate via a transient liquid phase bond.

A method of processing a CMC component includes preparing a fiber preform having a predetermined shape, and positioning the fiber preform with tooling having holes facing one or more surfaces of the fiber preform. After the positioning, a clamping pressure is applied to the tooling to force portions of the one or more surfaces of the fiber preform into the holes, thereby forming protruded regions of the fiber preform. During the application of the clamping pressure, the fiber preform is exposed to gaseous reagents at an elevated temperature, and a matrix material is deposited on the fiber preform to form a rigidized preform including surface protrusions. After removing the tooling, the rigidized preform is infiltrated with a melt for densification, and a CMC component having surface bumps is formed. When the CMC component is assembled with a metal component, the surface bumps may reduce diffusion at high temperatures.

The present invention provides a metal-ceramic base material and the like which allow a ceramic base material and a desired metal material to be easily joined. A metal-ceramic base material (30) to be joined to a metal material (40), includes: a ceramic base material (20); and a metal film (25) provided on the ceramic base material (20), the metal film (25) being formed by thermal spray of a mixed powder material containing aluminum, alumina, and nickel, at least part of the nickel being exposed on a surface of the metal film (25).

A method of preparing a substrate having a wetting surface, including confirming the presence of an open, interconnected pore network in a ceramic substrate to be wetted with a first metal, filling the open, interconnected pore network with a second metal, exuding the second metal to coat the surface of the substrate, and wetting the substrate with the first metal. The ceramic substrate is not decomposed by the first metal and the ceramic substrate is not decomposed by the second metal.

An aluminum nitride sintered body for use in a semiconductor manufacturing apparatus is provided. The aluminum nitride sintered body exhibits, in a photoluminescence spectrum thereof in a wavelength range of 350 nm to 700 nm obtained with 250 nm excitation light, a highest emission intensity peak within a wavelength range of 580 nm to 620 nm.

A ceramic material is provided by deliberately choosing the additions of oxides to form zirconium oxide, in particular for the use of a layer system which has a high resistance to sintering, high expansion tolerance and low thermal conductivity.

A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.

A bonding method is capable of firmly bonding a greater variety of materials using an electrochemical reaction. The bonding method includes a placement step of placing an oxygen ion conductor and a conductive member that includes an oxide layer on a surface thereof in contact with each other via the oxide layer, a connection step of connecting the oxygen ion conductor to the positive electrode side of a voltage application device and connecting the conductive member to the negative electrode side of the voltage application device, and a voltage application step of applying voltage between the oxygen ion conductor and the conductive member to bond the oxygen ion conductor and the conductive member.

A method of processing a ceramic matrix composite (CMC) component includes extracting silicon from a surface region of the CMC component such that free silicon is present in the surface region at a reduced amount of about 5 vol. % or less. The extraction comprises contacting the surface region with a wicking medium comprising an element reactive with silicon. The extraction is carried out at an elevated temperature prior to assembling the CMC component with a metal component.

Methods for repairing composite cylindrical components are provided. One exemplary method for repairing a cylindrical component defining an axial direction, a radial direction, and a circumferential direction includes removing a damaged region of the cylindrical component. A flange extending from a cylindrical body of the cylindrical component is included in the damaged region. One or more arc segments that extend along the circumferential direction are connected with the existing cylindrical component. At least one of the arc segments includes a prefabricated flange. One or more plies are laid up to connect the arc segments with the existing cylindrical component to repair the damaged region of the cylindrical body and the prefabricated flange formed integrally with one of the arc segments replaces the damaged portion of the flange. Repaired cylindrical components are also provided.