The present disclosure relates to laminated armor materials for enhanced ballistic protection. In particular, the present disclosure relates to laminated armor materials comprising first and second armor materials and a laminated adhesive layer comprising nanomaterial fillers.

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit substrate and the ceramic substrate are stacked and positioned by the temporary fixing material which has been melted, and by cooling the temporary fixing material the stacked copper substrate and ceramic substrate are temporarily fixed; and a joining step for forming a joined body in which the copper circuit substrate and the ceramic substrate are joined by heating with pressurizing the laminated body in the stacking direction.

The invention relates to a metal-ceramic substrate and to a method for the production thereof, the substrate including at least one ceramic layer having first and second surface sides, at least one of the surface sides of which is provided with a metallization, wherein the ceramic material forming the ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide. The ceramic layer contains aluminum oxide, zirconium dioxide and yttrium oxide in the following proportions, in each case in relation to the total weight thereof: zirconium dioxide between 2 and 15 percent by weight; yttrium oxide between 0.01 and 1 percent by weight; and aluminum oxide between 84 and 97 percent by weight, wherein the average grain size of the aluminum oxide used is between 2 and 8 micrometers and the ratio of the length of the grain boundaries of the aluminum oxide grains to the total length of all the grain boundaries is greater than 0.6.

Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

There is herein described a ceramic phosphor target which may be used in a laser-activated remote phosphor application. The target comprises a substantially flat ceramic phosphor converter comprised of a photoluminescent polycrystalline ceramic which is attached to a reflective metal substrate by a high thermal conductivity adhesive.

A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of thermal expansion of a lower plate of an electrostatic chuck similar to a coefficient of thermal expansion of an upper plate of the electrostatic chuck.