A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

The disclosure describes techniques for forming a surface layer of an article including a CMC using a cast. In some examples, the surface layer includes three-dimensional surface features, which may increase adhesion between the CMC and a coating on the CMC. In some examples, the surface layer may include excess material, with or without three-dimensional surface features, which is on the CMC. The excess material may be machined to remove some of the excess material and facilitate conforming the article to dimensional tolerances, e.g., for fitting the article to another component. The excess material may reduce a likelihood that the CMC (e.g., reinforcement material in the CMC) is damaged by the machining.

A dry granular ceramic tile from a wet slurry spraying process and a preparation method thereof, comprises: applying an overglaze on a green body, applying a pattern by ink-jet printing, applying a dry granular glaze by bell-shaped spraying, and sintering to obtain ceramic tiles. The dry granular glaze contains: by mass percentage, dry granular frit A: 15%, dry granular frit B: 12% to 15%, dry granular frit C: 13% to 17%. The softening temperature of the dry granular frit A is 1135° C. to 1175° C., 980° C. to 1050° C. for the dry granular frit B, and 1020° C. to 1127° C. for the dry granular frit C. The dry granular frits used in the present invention adopts a combination of dry granular frits with three different melting points, and using such a matching method, it is convenient for the effective adjustment of the brick shape and the firing temperature during production.

A dry granular ceramic tile from a wet slurry spraying process and a preparation method thereof, comprises: applying an overglaze on a green body, applying a pattern by ink-jet printing, applying a dry granular glaze by bell-shaped spraying, and sintering to obtain ceramic tiles. The dry granular glaze contains: by mass percentage, dry granular frit A: 15%, dry granular frit B: 12% to 15%, dry granular frit C: 13% to 17%. The softening temperature of the dry granular frit A is 1135° C. to 1175° C., 980° C. to 1050° C. for the dry granular frit B, and 1020° C. to 1127° C. for the dry granular frit C. The dry granular frits used in the present invention adopts a combination of dry granular frits with three different melting points, and using such a matching method, it is convenient for the effective adjustment of the brick shape and the firing temperature during production.

A pillar shaped honeycomb structure includes: a porous partition wall that defines a plurality of cells, the cells forming flow paths for a fluid, the cells extending from an inflow end face to an outflow end face; and an outer peripheral wall located at the outermost circumference. The cells include: a plurality of cells A wherein a side of the inflow end face is opened and the outflow end face has a plugged portion; and a plurality of cells B wherein a side of the outflow end face is opened and the inflow end face has a plugged portion, the cells B being arranged alternately with the cells A. One or both of the plugged portion of the cells A and the plugged portions of the cells B contain a magnetic substance and glass.

A pillar shaped honeycomb structure includes: a porous partition wall that defines a plurality of cells, the cells forming flow paths for a fluid, the cells extending from an inflow end face to an outflow end face; and an outer peripheral wall located at the outermost circumference. The cells include: a plurality of cells A wherein a side of the inflow end face is opened and the outflow end face has a plugged portion; and a plurality of cells B wherein a side of the outflow end face is opened and the inflow end face has a plugged portion, the cells B being arranged alternately with the cells A. One or both of the plugged portion of the cells A and the plugged portions of the cells B contain a magnetic substance and glass.

A fired ceramic article including a screen printed layer of primer on a portion of the fired ceramic body. The thickness of the primer layer is less than 25 microns. A machine-readable code is laser marked onto the screen printed layer of primer. Methods of marking a ceramic article are also provided.

A fired ceramic article including a screen printed layer of primer on a portion of the fired ceramic body. The thickness of the primer layer is less than 25 microns. A machine-readable code is laser marked onto the screen printed layer of primer. Methods of marking a ceramic article are also provided.

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.