Embodiments of the present disclosure generally relate to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A substrate, such as a silicon wafer, is provided as a base for forming an optical device. A transparent layer is disposed on a first surface of the substrate, and a structure layer is disposed on the transparent surface. An etch mask layer is disposed on a second surface of the substrate opposite the first surface, and a window or opening is formed in the etch mask layer to expose a portion of the second surface of the substrate. A plurality of nanostructures is then formed in the structure layer, and a portion of the substrate extending from the window to the transparent layer is removed. A portion of the transparent layer having nanostructures disposed thereon is then detached from the substrate to form an optical device.

A technique is described for the application of three-dimensional (3D) relief to a substrate such as a ceramic tile using digital inkjet technology. In an example embodiment, the introduced technique includes application of binder ink to a portion of the surface of a substrate using a digital inkjet process. This binder ink forms a barrier layer which protects the portion of the surface of the substrate. Next, a brushing process is applied to remove unprotected portions of the substrate, thereby forming the 3D relief in the substrate.

A method of decontaminating a lithium conducting ceramic oxide material. The method includes soaking the lithium conducting ceramic oxide material having a first thickness of surface contaminants in a first organic solvent containing an inorganic salt at an inorganic salt concentration to obtain a soaked lithium conducting ceramic oxide material. The method further includes rinsing the soaked lithium conducting ceramic oxide material in a second organic solvent to obtain a decontaminated lithium conducting ceramic oxide material having a second thickness of surface contaminants less than the first thickness of surface contaminants.

A method for removing a coating including a rare earth silicate from a substrate including a ceramic or ceramic matrix composite may include contacting a coating comprising a rare earth silicate with a liquid comprising an active species. The active species may include at least one of a mineral acid or a base. The method also may include working the coating to cause removal of at least a portion of the coating.

A method for removing a coating including a rare earth silicate from a substrate including a ceramic or ceramic matrix composite may include contacting a coating comprising a rare earth silicate with a liquid comprising an active species. The active species may include at least one of a mineral acid or a base. The method also may include working the coating to cause removal of at least a portion of the coating.

A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.

A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.

An example article includes a substrate and a barrier coating on the substrate extending from an inner interface facing the substrate to an outer surface opposite the inner interface. The barrier coating includes a bulk matrix and a plurality of discrete plugs inset within the bulk matrix and dispersed across the outer surface of the barrier coating. An example technique includes forming the barrier coating on the substrate of a component.

The present invention relates to a new process for manufacturing a silicon carbide (SiC) coated body by depositing SiC in a chemical vapor deposition method using dimethyldichlorosilane (DMS) as the silane source on a graphite substrate. A further aspect of the present invention relates to the new silicon carbide coated body, which can be obtained by the new process of the present invention, and to the use thereof for manufacturing articles for high temperature applications, susceptors and reactors, semiconductor materials, and wafer.

A method for producing ceramic tiles, comprising the steps of providing a ceramic mixture, forming a raw tile with a body having an upper surface based on said mixture, and firing said raw tile to produce said ceramic tile, wherein the method comprises a step of producing a relief structure on said upper surface and wherein said structure is produced after said forming step and before said firing step.