An etchant composition is presented. The composition includes: 18 wt % to 25 wt % of a first organic acid compound; 15 wt % to 20 wt % of a second organic acid compound; 8.1 wt % to 9.9 wt % of an inorganic acid compound; 1 wt % to 4.9 wt % of a sulfonic acid compound; 10 wt % to 20 wt % of a hydrogen sulfate salt compound; 1 wt % to 5 wt % of a nitrogen-containing dicarbonyl compound; 1 wt % to 5 wt % of an amino acid derivative compound; 0.1 wt % to 2 wt % of an iron-containing oxidizing agent compound; and a balance amount of water.

An etchant composition is presented. The composition includes: 18 wt % to 25 wt % of a first organic acid compound; 15 wt % to 20 wt % of a second organic acid compound; 8.1 wt % to 9.9 wt % of an inorganic acid compound; 1 wt % to 4.9 wt % of a sulfonic acid compound; 10 wt % to 20 wt % of a hydrogen sulfate salt compound; 1 wt % to 5 wt % of a nitrogen-containing dicarbonyl compound; 1 wt % to 5 wt % of an amino acid derivative compound; 0.1 wt % to 2 wt % of an iron-containing oxidizing agent compound; and a balance amount of water.

A method for removing a ceramic coating from a substrate is presented. The method includes contacting the ceramic coating with a composition including a fluoride source and nitric acid. A method of forming a component having a variation in saturation magnetization is presented. The method includes masking selected portions of a surface of a metallic component using a ceramic coating to form a masked metallic component; selectively diffusing nitrogen into the metallic component by exposing the masked metallic component to a nitrogen-rich atmosphere; and removing the ceramic coating from the surface of the metallic component by contacting the ceramic coating with a composition including the fluoride source and nitric acid.

An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

An element body has an exposed surface including a selective surface material which is to be coated with the coating material and a non-selected surface material which is not to be coated with the coating material. The selected surface material has different material properties than the non-selected surface material. The element body is coated with the coating material by applying a surface modifier only on the surface of the selected surface material and thereafter coating the surface of the selected surface material to which the surface modifier has been applied with the coating material.

A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.

A housing for a portable electronic device is disclosed. The housing is composed of yttria-sensitized zirconia. Yttria-sensitized zirconia has from about 1.5 to about 2.5 mole percent yttria, and more typically about 2 mole percent yttria, and most typically 2 mole percent yttria, in zirconia. Yttria-sensitized zirconia is both tough and able to limit the formation and propagation of micro-cracks. Methods for manufacturing yttria-sensitized zirconia composed housings are also disclosed.

A housing for a portable electronic device is disclosed. The housing is composed of yttria-sensitized zirconia. Yttria-sensitized zirconia has from about 1.5 to about 2.5 mole percent yttria, and more typically about 2 mole percent yttria, and most typically 2 mole percent yttria, in zirconia. Yttria-sensitized zirconia is both tough and able to limit the formation and propagation of micro-cracks. Methods for manufacturing yttria-sensitized zirconia composed housings are also disclosed.

A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.

A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.