A battery insulation sheet includes a substrate, and an aerogel layer on the substrate, wherein the aerogel layer includes a fibrous support; an aerogel; and a functional material including a binder, a dispersant, or a combination thereof, and satisfies Formula 1 below:

[00001]$\begin{array}{cc}50A100,000,A=T_i/D_s,& \mathrm{Formula}1\end{array}$

wherein, in Formula 1, T.sub.i denotes a thickness of the aerogel layer, and D.sub.s denotes an average diameter of the fibrous support.

A resin-impregnated boron nitride body includes a polymer-derived boron nitride and a resin. A process for manufacturing such a resin-impregnated boron nitride body includes: polymerizing a boron nitride molecular precursor into a preceramic polymer shaping the preceramic polymer to form an infusible polymer body; submitting the polymer body to a thermal treatment to obtain a boron nitride body; impregnating the boron nitride body with a resin; and curing the resin.

A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to 45 C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

A method of producing ceramic wafer includes a forming step and processing step. The processing step includes forming positioning notch or positioning, flat edge and edge profile, which avoids the ceramic wafers to have processing defect during cutting, grinding, and polishing, for increasing yield. The ceramic particles for producing ceramic wafer include nitride ceramic powder, oxide ceramic powder, and nitride ceramic powder. The ceramic wafer has low dielectric constant, insulation, and excellent heat dissipation, which can be applied for the need of semiconductor process, producing electric product and semiconductor equipment.

A ceramic and polymer composite including: a first continuous phase comprising a sintered porous ceramic having a solid volume of from 50 to 85 vol % and a porosity or a porous void space of from 50 to 15 vol %, based on the total volume of the composite; and a second continuous polymer phase situated in the porous void space of the sintered porous ceramic. Also disclosed is a composite article, a method of making the composite, and a method of using the composite.

A silicon carbide composite that is lightweight and has high thermal conductivity as well as a low thermal expansion coefficient close to that of a ceramic substrate, particularly a silicon carbide composite material suitable for heat dissipating components that are required to be particularly free of warping, such as heat sinks. A method for manufacturing a silicon carbide composite obtained by impregnating a porous silicon carbide molded body with a metal having aluminum as a main component, wherein the method for manufacturing a silicon carbide composite material is characterized in that the porous silicon carbide molded article is formed by a wet molding method, and preferably the wet molding method is a wet press method or is a wet casting method.

Embodiments of disclosure may provide a method for forming an aluminum-containing nitride ceramic matrix composite, comprising heating a green body, an aluminum-containing composition, ammonia and a mineralizer composition in a sealable container to a temperature between about 400 degrees Celsius and about 800 degrees Celsius and a pressure between about 10 MPa and about 1000 MPa, to form an aluminum-containing nitride ceramic matrix composite characterized by a phosphor-to-aluminum nitride (AlN) ratio, by volume, between about 1% and about 99%, by a porosity between about 1% and about 50%, and by a thermal conductivity between about 1 watt per meter-Kelvin and about 320 watts per meter-Kelvin. The green body comprises a phosphor powder comprising at least one phosphor composition, wherein the phosphor powder particles are characterized by a D50 diameter between about 100 nanometers and about 500 micrometers, and the green body has a porosity between about 10% and about 80%. The aluminum-containing composition has a purity, on a metals basis, between about 90% and about 99.9999%. The fraction of free volume within the sealable container contains between about 10% and about 95% of liquid ammonia prior to heating the green body, the aluminum-containing composition, ammonia and the mineralizer composition in the sealable container.

A component includes a component body in which at least one cavity is formed, wherein a wall surface of the component body, which wall surface delimits the cavity, is at least partially coated with a coating. The design of the component is based on a porous preform made in one or more parts from an inorganic matrix (M1), the preform having the cavity and a porous pre-coating made from an inorganic matrix (M2), the pre-coating coating at least part of a wall surface of the preform that delimits the cavity The porous preform and the porous pre-coating are infiltrated with an inorganic infiltrate (M3). The infiltrated preform forms the component body, and the infiltrated pre-coating forms the coating. A method for producing the component, wherein the preform and the pre-coating are infiltrated so as to produce the component body comprising the coating is also disclosed.

One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000 C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10.sup.6-times, based on the ambient air at the same temperature under equilibrium conditions.

A method for forming a contact piece for a circuit breaker, the contact piece comprising a reinforcement phase and a conductive phase, the method comprising: providing a slurry of the reinforcement phase in liquid; freeze casting the slurry, to form a cast comprising a frozen liquid structure and a reinforcement phase structure; removing the frozen liquid structure from the cast, to form a foam comprising the reinforcement phase structure; sintering the foam, to form a sintered foam; and infiltrating the sintered foam with the conductive phase, to form a piece part.