An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.

A vaporization core, a method of manufacturing the same, and an electronic vaporization device comprising the same are disclosed. The vaporization core includes a tubular porous substrate for forming a vaporization cavity and configured to guide liquid outside the tubular porous substrate into the vaporization cavity and a heating element disposed on an inner wall of the tubular porous substrate and configured to heat and vaporize the liquid guided into the vaporization cavity.

One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10.sup.−6-times, based on the ambient air at the same temperature under equilibrium conditions.

A method of manufacturing a metal-coated member includes: providing a composite ceramic member including a ceramic part, and a connection part connected to the ceramic part; disposing a precious metal layer on a surface region that includes at least a portion of a surface of the ceramic part and a portion of a surface of the connection part, the precious metal layer including a precious metal; and removing at least a portion of the precious metal layer that is on the surface of the ceramic part and delineated by the boundary between the ceramic part and the connection part. The connection part has stronger adhesion to the precious metal than the ceramic part.

The present disclosure provides a composite including a nitride sintered body having a porous structure and a semi-cured product of a heat-curable composition impregnated into the nitride sintered body, wherein a dielectric breakdown voltage obtainable after disposing the composite between adherends, heating and pressurizing the composite for 5 minutes under the conditions of 200° C. and 10 MPa, and further heating the composite for 2 hours under the conditions of 200° C. and atmospheric pressure, is greater than 5 kV.

A composite member includes a matrix part including an inorganic substance, and an organic infrared absorbing material present in a dispersed state inside the matrix part. The composite member has a porosity of 20% or less in a section of the matrix part. A heat generation device includes the composite member, and an infrared light source for irradiating the composite member with infrared rays. A building member and a light emitting device each include the composite member, or the heat generation device.

A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A gas plug of the present disclosure is composed of a columnar porous composite in which a plurality of silicon compound phases containing silicon carbide as a main component are connected to each other via a silicon phase having silicon as a main component. The porous composite is housed inside a tubular body made from a dense ceramic.

One aspect of the present invention is a composite including: a porous boron nitride sintered body; and a resin filled in pores of the boron nitride sintered body, wherein the boron nitride sintered body has an average pore diameter of 3.5 μm or less.

One aspect of the present disclosure provides a production method for a composite, the method including: a cooling step of performing cooling under a pressurized condition in a state where a heated molten material of a thermosetting composition is brought into contact with a resin-impregnated body, in which the above-described resin-impregnated body includes a nitride sintered body having a porous structure and a semi-cured product of the thermosetting composition impregnated into the above-described nitride sintered body.