A thermal formation sintering compound containing a binder, a sinterable powder material and a pore formation material, for formation into a predetermined shape in a thermal formation step, removal of the binder in a degreasing step, and sintering of the powder material in a sintering step is provided. The binder contains a low-temperature draining component which melts in the thermal formation step, begins draining at a temperature lower than a draining temperature of the pore formation material, and drains at a temperature lower than a temperature at which the pore formation material drains; and a high-temperature draining component which melts in the thermal formation step, begins draining after the pore formation material begins draining, and drains at a temperature higher than does the pore formation material.

A modification layer on a surface of a ceramic substrate, includes, in parts by mass: 56 to 67.5 parts of silicon dioxide; 12 to 18 parts of aluminum oxide; and 2.8 to 5.5 parts of lithium oxide. In an embodiment, the modification layer further includes, in parts by mass: at least one of 1.8 to 2.8 parts of phosphorus pentoxide; 0.5 to 2.0 parts of calcium oxide; 0.15 to 1.5 parts of magnesium oxide; and 2.5 to 5.25 parts of barium oxide.

An insulating material, especially a non-flammable thermally insulating material containing water glass and a plastic component consisting of a mixture containing 43 to 57.5 weight percent of a plastic component, 30 to 47 weight percent of an aqueous solution of silicate, 9 to 11.5 weight percent of hollow glass microspheres, and 0.1 to 1 weight percent of a water glass stabilizer. Method of production of the insulating material, especially method of production of the non-flammable thermally insulating material lying in the fact that, as the first step, a water glass stabilizer is added into the aqueous solution of silicate and, at the same time, a mixture of phenyl methyl diisocyanate and branched polyol is prepared and then the aqueous solution of silicate is intermixed with the mixture of phenyl methyl diisocyanate and branched polyol and thereafter hollow glass spheres are added into the resulting mixture and everything is then thoroughly mixed again.

It is an object of the present disclosure to provide a thin-film carbon foam and a method of manufacture the same. It is another object of the present disclosure to provide a stack carbon foam having fewer through holes and a method of manufacturing the same. The carbon foam of the present disclosure is, for example, a stack carbon foam being a stack of at least two monolayer carbon foams stacked one another, each monolayer carbon foam comprising linear portions and node portions joining the linear portions, or a carbon foam comprising linear portions and node portions joining the linear portions, wherein the ratio of the number of large through holes having a diameter of 1 mm or more to the surface area of the carbon foam is 0.0003/mm.sup.2 or less.

A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides.

[Ag.sub.2O]≥[TeO.sub.2]≥[V.sub.2O.sub.5]≥[Li.sub.2O]  (1)

2[V.sub.2O.sub.5]≥[Ag.sub.2O]+[Li.sub.2O]≥40  (2)

(In the formula, [X] represents a content of component X, and the unit thereof is “mol %”; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.

A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.

One aspect of the present invention is a method for producing a composite, including a step of placing a porous boron nitride sintered body immersed in a resin composition under a pressurized condition and then placing the boron nitride sintered body immersed in the resin composition under a pressure condition lower than the pressurized condition, wherein the step is repeated a plurality of times.

The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point: a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein hearing is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.

A resin-impregnated boron nitride body includes a polymer-derived boron nitride and a resin. A process for manufacturing such a resin-impregnated boron nitride body includes: polymerizing a boron nitride molecular precursor into a preceramic polymer shaping the preceramic polymer to form an infusible polymer body; submitting the polymer body to a thermal treatment to obtain a boron nitride body; impregnating the boron nitride body with a resin; and curing the resin.

A toughened ceramic component having a residual compressive stress and methods of forming the toughened ceramic component is disclosed. The ceramic component may include an internal portion having a first coefficient of thermal expansion (CTE) and an external portion substantially surrounding the internal portion and forming an exterior surface of the ceramic component. The external portion may have a second CTE that is less than the first CTE. Additionally, the external portion may be in compressive stress.