C04B2235/66

Ceramic electronic component and method of manufacturing the same

A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.

Multilayer ceramic capacitor and manufacturing method thereof

Provided is a multilayer ceramic capacitor having dielectric layers and internal electrode layers laminated alternately on one another. Each internal electrode layer comprises a common ceramic material containing 3 to 25% by weight of rare earth elements, and through the rare earth elements, high dielectric layers are formed on the interfaces between the dielectric layers and the internal electrode layers.

Modified NiTa.SUB.2.O.SUB.6.-based microwave dielectric ceramic material co- sintered at low temperature and its preparation method

The invention belongs to the field of electronic ceramics and its manufacturing, in particular to the modified NiTa.sub.2O.sub.6-based microwave dielectric ceramic material co-sintered at low temperature and its preparation method. Based on the low melting point characteristics of CuO and B.sub.2O.sub.3, and the radius of Cu.sup.2+ ions is similar to that of Ni.sup.2+ and Ta.sup.5+ ions, the chemical general formula of the invention is designed as xCuO-(1-x)NiO-[7.42y+(xy/14.33)]B.sub.2O.sub.3—Ta.sub.2O.sub.5, and the molar content of each component is adjusted from raw materials. The main crystalline phase of NiTa.sub.2O.sub.6 is synthesized at a lower pre-sintering temperature, and NiTa.sub.2O.sub.6-based ceramic material with low-temperature sintering characteristics and excellent microwave dielectric properties are directly synthesized at one time, which broadened the application range in LTCC field.

Resonant multilayer ceramic capacitors

Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC V.sub.PP wherein the rated AC V.sub.PP is higher than the rated DC voltage.

Dielectric composition and multilayer ceramic electronic component
11657972 · 2023-05-23 · ·

A dielectric composition includes dielectric particles. At least one of the dielectric particles include a main phase and a secondary phase. The main phase has a main component of barium titanate. The secondary phase exists inside the main phase and has a higher barium content than the main phase.

Method of producing a multi-layer ceramic electronic component, multi-layer ceramic electronic component, and circuit board
11715604 · 2023-08-01 · ·

A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.

PROCESSES AND MATERIALS FOR CASTING AND SINTERING GREEN GARNET THIN FILMS
20220250988 · 2022-08-11 ·

Set forth herein are processes and materials for making ceramic thin films by casting ceramic source powders and precursor reactants, binders, and functional additives into unsintered thin films and subsequently sintering the thin films under controlled atmospheres and on specific substrates.

FABRICATION OF DOWNHOLE DRILLING TOOLS
20220250989 · 2022-08-11 ·

A method of forming a composite cutter for a downhole drilling tool is described. The method includes: mixing a polycrystalline diamond powder and a cubic boron nitride powder with a molar ratio between 0.1 and 0.9 to form a catalyst-free composite mixture; placing the catalyst-free composite mixture into a mold configured in a shape of a cutter; exposing the catalyst-free composite mixture to an ultra-high-pressure, high-temperature treatment including a pressure between 11 Gigapascals (GPa) and 20 GPa, and a temperature between 1300 Kelvins (K) and 2600 K to form a solid composite body; and cooling the solid composite body to form the composite cutter.

Fluorescent member, its manufacturing method, and light-emitting apparatus

A fluorescent member according to present invention is composed of a sintered body for wavelength conversion containing a matrix containing magnesium oxide and magnesium hydroxide as main components, and phosphor particles dispersed in the matrix. A thermal conductivity of the fluorescent member is preferably 5 W/(m.Math.K) or higher. A fluorescent member having both a satisfactory thermal conductivity and a satisfactory fluorescent property is provided without requiring a high-temperature sintering process (a high-temperature process at a temperature higher than 250° C.). Further, a method for manufacturing such a fluorescent member and a light-emitting apparatus using such a fluorescent member are provided.

CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
20220084752 · 2022-03-17 · ·

A ceramic electronic device includes a multilayer structure having a parallelepiped shape in which a plurality of dielectric layers and a plurality of internal electrode layers are alternately stacked in a vertical direction, the plurality of internal electrode layers being alternately exposed to two end faces of the parallelepiped shape. A side margin section is a section covering edges of the plurality of internal electrode layers in an extension direction toward two side faces of the parallelepiped shape. The side margin section has a structure in which a plurality of dielectric layers, each containing a ceramic as a main component, and a plurality of conductive layers, each containing a metal as a main component, are alternately stacked in the vertical direction. The plurality of conductive layers are respectively spaced and separated from the plurality of internal electrode layers.