A substrate processing brush according to some embodiments of the present disclosure is provided. The substrate processing brush includes a holder; a substrate processing pad detachably disposed in the holder, processing the substrate; and a substrate processing sweeper connected to the holder, processing the substrate together with the substrate processing pad, wherein a first portion of the substrate processing pad is disposed inside the holder, and a second portion of the substrate processing pad is protruded to the outside of the holder by passing through one surface of the holder, and the substrate processing sweeper is connected to one surface of the holder so that it is to be adjacent to the second portion of the substrate processing pad protruded to the outside of the holder, and is extended from one surface of the holder.

An interchangeable-tool machine interface for a cleaning brush, includes a drive interface and output interface that are separable and connectable without tools and are separable or connectable in several discrete angular positions by axial displacement along a common axis of rotation. The output interface has centering walls and resiliently displaceable latching-means walls, the centering walls and the resiliently displaceable latching means walls are arranged so as to be angularly offset from one another in the circumferential direction about the axis of rotation. The drive interface has centering and mating latching-means walls that are arranged so as to be angularly offset from one another in the circumferential direction about the axis of rotation and, per wall, are designed to correspond both to the centering walls and to the latching means walls of the output interface.

A wire-shaped grinding element (10A, 10B) is used as a grinding element for a polishing brush. The wire-shaped grinding element (10A, 10B) includes inorganic filaments and a resin that impregnates the inorganic filaments and is cured. The inorganic filaments contain 80 to 90% by weight of an alumina component and 20 to 10% by weight of a silica component. The crystal structure of the inorganic filaments includes intermediate alumina. The silica component is in an amorphous state. The BET specific surface area of the inorganic filaments is 30 m.sup.2/g or smaller.