There is provided a first substrate having a first main surface, a second substrate having a second main surface, a bonding member bonding the first main surface and the second main surface, and a flow path positioned between the first substrate and the second substrate and extended in a parallel direction with the first main surface and the second main surface, and the bonding member has a projection which is protruded from a portion between the first main surface and the second main surface toward an inner part of the flow path, the flow path includes a first portion having the projection provided in an inner part and a second portion linked to the first portion adjacently to an opposite side to a side where the projection of the first portion is provided, and a height of the first substrate is greater than a height of the second portion in the thickness direction.

The object of the present invention is an integrally bonded composite component, a method for the production thereof, and the use thereof. The invention particularly relates to integrally bonded transparent ceramic composite components, to a method for the production of such ceramic composite components, and to the use thereof.

A joint structure jointing a ceramic member and a metal member is a joint structure jointing a ceramic member and a metal member that are provided in a device provided on a portion through which gas passes. The joint structure has a joint portion that joints the ceramic member and the metal member. The joint portion includes a glass portion made of a glass and a metal solder portion having higher corrosion resistance with respect to the gas than the glass. An area where the metal solder portion contacts to the gas is larger than an area where the glass portion contacts to the gas.

A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.

The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.

A method of making a stoichiometric monazite (LaPO.sub.4) composition or a mixture of LaPO.sub.4 and LaP.sub.3O.sub.9 composition, as defined herein. Also disclosed is a method of joining or sealing materials with the compositions, as defined herein.

A method of making a stoichiometric monazite (LaPO.sub.4) composition or a mixture of LaPO.sub.4 and LaP.sub.3O.sub.9 composition, as defined herein. Also disclosed is a method of joining or sealing materials with the compositions, as defined herein.

A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

The invention relates to a transparent composite material for various applications, having crystalline and amorphous inorganic materials with improved material properties.

The invention relates to a method for joining a ceramic friction element (11) to a piezoelectric element (1), comprising, among other things, the following steps: pressing (14) a joining surface (10) of the friction element and a contact surface (9) of the piezoelectric element against each other with a low-melting glass mass (12) arranged therebetween and maintaining the pressing force for all subsequent steps; heating (17) the piezoelectric element and the friction element to a defined temperature above the Curie point of the piezoceramic material of the piezoelectric element and above the melting point of the low-melting glass mass; thereafter, while maintaining the temperature, applying an electric polarization voltage Up to electrodes of the piezoelectric element; removing the polarization voltage after the Curie point has been fallen below; and cooling the piezoelectric element and the friction element to room temperature without an electric voltage being applied to the electrodes.