Patent classifications
C04B2237/12
CUTTING ELEMENTS WITH IMPACT RESISTANT DIAMOND BODY
Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.
METHOD FOR PRODUCING A COMPOSITE MATERIAL
A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterised by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 m; heating the base material and the additional layer on the first surface to at least partially melt the solder layer and connecting the base material to the at least one additional layer.
Copper/ceramic joined body and insulating circuit substrate
A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.
METHOD FOR JOINING AT LEAST TWO COMPONENTS
The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.
METHOD AND SUBSTRATES FOR MATERIAL APPLICATION
A method of and an apparatus for making a composite material is provided. The composite is able to be formed by mixing a binder and a physical property enhancing material to form a mixer. The binder is able to be pitch, such as mesophase pitch. The physical property enhancing material is able to be fiber glass. The mixer is able to be processed through a lamination process, stabilization/cross-link process, and carbonization. The composite material is able to be applied in the field of electronic components and green technology, such as a substrate of a photovoltaic cell.
BONDING METHOD AND BONDED STRUCTURE
A bonding target member typically has a solid bonding material with aluminum as a main component interposed between a metal member and a ceramic member. These elements and an elastic member are pressurized by a pressurizing section and a bonding tool section of a resonator in a vertical direction. The bonding tool section of the resonator resonates with sound vibration or ultrasound vibration transmitted from an oscillator. The metal member and the ceramic member can alternatively be bonded together without the intermediate bonding material. In both cases, bonding at ordinary temperature in the atmosphere is possible. When the ceramic member has a thickness resistant to pressurization and vibration energy at the time of bonding to resist cracking, the elastic member may be disposed on the metal member side, or may not be used.
3D infiltration method
The invention relates to a method for producing three-dimensional molded parts in two method steps and infiltrating the molded part, as well as a material system.
Ceramic structural body
A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.
Method for Producing a Metal-Ceramic Substrate, and a Metal-Ceramic Substrate
A method for producing a metal-ceramic substrate includes attaching a metal layer to a surface side of a ceramic layer, the metal layer being structured into a plurality of metallization regions respectively separated from one another by at least one trench-shaped intermediate space to form conductive paths and/or connective surfaces and/or contact surfaces. The method further includes filling the at least one trench-shaped intermediate space with an electrically insulating filler material, and covering first edges of the metallization regions facing and adjoining the surface side of the ceramic layer in the at least one trench-shaped intermediate space, as well as at least one second edge of the metallization regions facing away from the surface side of the ceramic layer in the at least one trench-shaped intermediate space, by the electrically insulating filler material.
CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE MANUFACTURED THEREBY
A ceramic substrate manufacturing method and a ceramic substrate manufactured thereby, may include a seed layer, a brazing filler layer, and a metal foil that are laminated on a ceramic substrate and that are brazed such that the metal foil is firmly bonded to the ceramic substrate by a brazing joint layer. Such methods and devices may substantially improve the adhesion of the metal foil and the ceramic substrate.