A method for forming a ceramic according to one embodiment includes electrophoretically depositing a plurality of layers of particles of a non-cubic material. The particles of the deposited non-cubic material are oriented in a common direction.

There is provided a ceramic substrate including: a silicon nitride crystal phase containing a plurality of silicon nitride crystals, and grain boundaries between the silicon nitride crystals; and a silicate phase containing magnesium silicate crystals and rare earth silicate crystals, respective maximum particle sizes of the magnesium silicate crystals and the rare earth silicate crystals being smaller than that of the silicon nitride crystals, the silicate phase being positioned in the grain boundaries.

In one embodiment, a method for forming a ceramic, metal, or cermet includes: providing a first solution comprising a first solvent and a first material to a device including an electrophoretic deposition (EPD) chamber; applying a voltage difference across a first electrode and a second electrode of the device; electrophoretically depositing the first material above the first electrode to form a first layer; introducing a second solution including a second solvent and a second material to the EPD chamber; applying a voltage difference across the first electrode and the second electrode; and electrophoretically depositing the second material above the first electrode to form a second layer. The first layer has a first composition, a first microstructure, and a first density, while the second layer has a second composition, a second microstructure, and a second density. At least one of the foregoing features of the first and second layers are different.

A hollow CMC article, a mandrel for forming the article and a method for forming the article are disclosed. The article includes a ply-wrap layer defining a cavity. The ply-wrap layer includes a first face, a second face, a root portion bridging the faces, and a plurality of CMC wrap plies. The root portion defines a terminus of the ply-wrap layer including a cross-sectional conformation consisting of a curve having a single turning point. Each of the plurality of CMC wrap plies are disposed along the first face, wrap over the root portion, and extend along the second face. The hollow article further includes a plurality of CMC lateral plies disposed along the faces.

A method of forming a substrate support for use in a processing chamber includes forming a porous region in each of a plurality of ceramic green sheets, stacking the plurality of ceramic green sheets, each having the porous region formed therein, to form a ceramic laminate, and sintering the ceramic laminate to form a monolithic ceramic body having a porous plug formed therein. The porous plug includes the porous regions in the plurality of ceramic green sheets that are sintered.

The present disclosure relates to a brazed superabrasive assemblies and method of producing brazed superabrasive assemblies. The brazed superabrasive assemblies may include a plurality of braze alloy layers that are positioned opposite a stress relieving layer. The stress relieving layer may have a solidus temperature that is greater than a solidus temperature of the plurality of braze alloy layers.

A hollow CMC article, a mandrel for forming the article and a method for forming the article are disclosed. The article includes a ply-wrap layer defining a cavity. The ply-wrap layer includes a first face, a second face, a root portion bridging the faces, and a plurality of CMC wrap plies. The root portion defines a terminus of the ply-wrap layer including a cross-sectional conformation consisting of a curve having a single turning point. Each of the plurality of CMC wrap plies are disposed along the first face, wrap over the root portion, and extend along the second face. The hollow article further includes a plurality of CMC lateral plies disposed along the faces.

A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

The invention relates to a copper-ceramic composite comprising: a ceramic substrate containing alumina; a copper or copper alloy coating on the ceramic substrate; the alumina has a mean grain shape factor R.sub.a(Al.sub.2O.sub.3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.