Patent classifications
C04B2237/32
Ceramic glaze having antimicrobial property
An antimicrobial ceramic glazing composition contains one or more antimicrobial agents disposed therein. Methods for making and using the glazing composition are disclosed, as well as substrates having a fired antimicrobial glaze thereon. The antimicrobial agents comprise metallic oxides, with a subset of the disclosed combinations exhibiting synergistic effect in fired glazes.
Ceramic glaze having antimicrobial property
An antimicrobial ceramic glazing composition contains one or more antimicrobial agents disposed therein. Methods for making and using the glazing composition are disclosed, as well as substrates having a fired antimicrobial glaze thereon. The antimicrobial agents comprise metallic oxides, with a subset of the disclosed combinations exhibiting synergistic effect in fired glazes.
Rigidized Hybrid Insulating Non-oxide Thermal Protection System and Method of Producing a Non-oxide Ceramic Composite for Making the Same
A thermal protection system is provided for a vehicle substructure. The thermal protection system comprises an outer layer for protecting the vehicle substructure. The thermal protection system further comprises an inner layer for conforming to the vehicle substructure. The thermal protection system also comprises an insulation layer sandwiched between the inner and outer layers. The insulation layer includes a porous low-density ceramic insulating material having a densified portion that covers an inner surface of the outer layer to strengthen adhesion.
SUBSTRATE SUPPORT ASSEMBLY HAVING SURFACE FEATURES TO IMPROVE THERMAL PERFORMANCE
A substrate support assembly including a ceramic body includes an upper surface. The upper surface includes a sealing ring at a periphery of the ceramic body, a plurality of mesas and a plurality of recessed features, wherein the plurality of recessed features are formed between the plurality of mesas. The ceramic body further includes one or more through holes to receive a thermally conductive gas, wherein molecules of the thermally conductive gas are to collide with the walls of the plurality of recessed features to increase an effective thermal accommodation coefficient (TAC) associated with the upper surface and increase an effective thermal conductivity of the thermally conductive gas as a result of the increase in the effective TAC associated with the upper surface.
HERMETIC HOUSING AND ELECTRONICS PACKAGE FOR AN IMPLANT DEVICE
The present invention relates to a hermetic package (40) suitable to be implanted in a body of an animal or a human patient. The housing (40) comprises a base part (50), a cover part (60) suitable to cover the base part (50), and a connecting means (70), provided at an interface between the base part (50) and the cover part (60). The base part (50) comprises a first hermetic material and the cover part comprises a second hermetic material and the connecting means (70) comprise a third hermetic material, adapted to hermetically seal the interior of the hermetic housing (40) from the outside of the hermetic housing (40). The present invention further refers to an implantable electronics package with such a housing, an implant, in particular a retinal implant, and a method to provide a hermetic housing for an implant.
MULTILAYER BODY AND ELECTRONIC COMPONENT
A multilayer body includes a multilayer structure including a glass ceramic layer including a glass and a filler and a ferrite layer including a ferrite, in which the glass ceramic layer has a glass content of about 30.0% or more by weight and about 80.0% or less by weight and a filler content of about 20.0% or more by weight and about 70.0% or less by weight, the glass included in the glass ceramic layer includes about 0.5% or more by weight and about 5.0% or less by weight R.sub.2O (R represents at least one selected from the group consisting of Li, Na, and K), about 0% or more by weight and about 5.0% or less by weight Al.sub.2O.sub.3, about 10.0% or more by weight and about 25.0% or less by weight B.sub.2O.sub.3, and about 70.0% or more by weight and about 85.0% or less by weight SiO.sub.2 based on the total weight of the glass, and the filler included in the glass ceramic layer includes at least one of SiO.sub.2 and Al.sub.2O.sub.3 and also includes about 5.0% or more by weight and about 15.0% or less by weight of a ferrite based on the total weight of the glass and the filler.
Ceramic structural body
A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.
FAST-DENSIFIED CERAMIC MATRIX COMPOSITE
A densified ceramic matrix composite (CMC) material densified CMC exhibits superior strength and toughness, relative to prior CMCs The material can be made by a process that includes impregnating a set of ceramic fibers with a non-fibrous ceramic material, resulting in a precursor matrix, stabilizing the precursor matrix, resulting in a stabilized matrix, and densifying the stabilized matrix using a frequency assisted sintering technology (FAST) process, resulting in the densified CMC material.
Method of producing bonded body and method of producing power module substrate
A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a CuP-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.
HOLLOW CERAMIC MATRIX COMPOSITE ARTICLE, MANDREL FOR FORMING HOLLOW CERAMIC MATRIX COMPOSITE ARTICLE, AND METHOD FOR FORMING HOLLOW CERAMIC MATRIX COMPOSITE ARTICLE
A hollow CMC article, a mandrel for forming the article and a method for forming the article are disclosed. The article includes a ply-wrap layer defining a cavity. The ply-wrap layer includes a first face, a second face, a root portion bridging the faces, and a plurality of CMC wrap plies. The root portion defines a terminus of the ply-wrap layer including a cross-sectional conformation consisting of a curve having a single turning point. Each of the plurality of CMC wrap plies are disposed along the first face, wrap over the root portion, and extend along the second face. The hollow article further includes a plurality of CMC lateral plies disposed along the faces.