In some examples, techniques of repairing and/or reinforcing oxide-oxide ceramic matrix composite (CMC) materials using a metallic material. In one example, a method including applying a metallic material at an edge of an oxide-oxide CMC substrate; and heating the metallic material to diffuse the metal material into the oxide-oxide CMC substrate at the edge. In another example, a method including applying a metallic material onto a damaged area of the oxide-oxide CMC; applying a reinforcing phase material onto the damaged area of the oxide-oxide CMC; and heating the metallic material to diffuse the metallic material into the oxide-oxide CMC and attach the reinforcing phase material to the damaged area of the oxide-oxide CMC.

A method of processing a CMC component includes preparing a fiber preform having a predetermined shape, and positioning the fiber preform with tooling having holes facing one or more surfaces of the fiber preform. After the positioning, a clamping pressure is applied to the tooling to force portions of the one or more surfaces of the fiber preform into the holes, thereby forming protruded regions of the fiber preform. During the application of the clamping pressure, the fiber preform is exposed to gaseous reagents at an elevated temperature, and a matrix material is deposited on the fiber preform to form a rigidized preform including surface protrusions. After removing the tooling, the rigidized preform is infiltrated with a melt for densification, and a CMC component having surface bumps is formed. When the CMC component is assembled with a metal component, the surface bumps may reduce diffusion at high temperatures.

The present application relates to a method of laser ablation of a metal-ceramic substrate, in which a laser is used under process conditions in which the formation of solid metal particles on the metal-ceramic substrate, which can separate from metal particles released by laser ablation near the ablation edge, is essentially avoided. Further the present application relates to a ceramic-metal substrate comprising a ceramic substrate and a metallization on at least one side of the ceramic substrate, wherein the ceramic substrate and the metallization have flush cutting edge.

A bonding method in which more variety of materials can be bonded than a conventional anodic bonding method includes: a disposing step of disposing an oxygen ion conductor and a bonded material to be bonded to the oxygen ion conductor such that they are brought in contact with each other; a connecting step of connecting the oxygen ion conductor to a negative side of a voltage application device and connecting the bonded material to a positive side of the voltage application device; and a voltage applying step of applying a voltage between the oxygen ion conductor and the bonded material so as to bond the oxygen ion conductor and the bonded material, wherein abutting surfaces of the oxygen ion conductor and the bonded material are processed such that they are in close contact with each other.

A structured multi-phase composite which include a metal phase, and a low stiffness, high thermal conductivity phase or encapsulated phase change material, that are arranged to create a composite having high thermal conductivity, having reduced/controlled stiffness, and a low CTE to reduce thermal stresses in the composite when exposed to cyclic thermal loads. The structured multi-phase composite is useful for use in structures such as, but not limited to, high speed engine ducts, exhaust-impinged structures, heat exchangers, electrical boxes, heat sinks, and heat spreaders.

The invention relates to a copper/ceramic composite comprisinga ceramic substrate which contains aluminum oxide, a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Cu)=d.sub.50/d.sub.arith; the aluminum oxide has a particle size number distribution with a median value d.sub.50, an arithmetic mean value d.sub.arith, and a symmetry value S(Al.sub.2O.sub.3)=d.sub.50/d.sub.arith; and S(Al.sub.2O.sub.3) and S(Cu) satisfy the following condition: 0.7<S(Al.sub.2O.sub.3)/S(Cu)1.4.

A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

A heater assembly includes a heating member, a mounting member that mounts the heating member to a wall of an external component, and an insulator disposed between the heating member and the wall. The insulator electrically insulates the heating member from the wall and blocks a ground path from the heating member to the wall of the external component.

A method of processing a ceramic matrix composite (CMC) component includes extracting silicon from a surface region of the CMC component such that free silicon is present in the surface region at a reduced amount of about 5 vol. % or less. The extraction comprises contacting the surface region with a wicking medium comprising an element reactive with silicon. The extraction is carried out at an elevated temperature prior to assembling the CMC component with a metal component.

A turbine component assembly is disclosed, including a first component, a second component, and an interface shield. The first component is arranged to be disposed adjacent to a hot gas path, and includes a ceramic matrix composite composition. The second component is adjacent to the first component and arranged to be disposed distal from the hot gas path across the first component. The interface shield is disposed on a contact region of the first component, and directly contacts the second component.