C04B2237/52

Method for producing a ceramic fixed partial denture
10172696 · 2019-01-08 ·

A method for making ceramic fixed partial dentures comprising separating the as-sintered partial denture structure, rejoining the retainers and pontic with glass, which forms a strong joint between the retainers and pontic after sintering. This method may produce ceramic long-span fixed partial dentures with a better fit.

SHAPED COMPOSITE PLY LAYUPS AND METHODS FOR SHAPING COMPOSITE PLY LAYUPS
20180370158 · 2018-12-27 ·

Ply layups and methods for forming composite components are provided. For example, a method for forming a composite component comprises laying up a plurality of composite plies to form a composite ply layup; partially processing the composite ply layup to form a green state layup; machining the green state layup; assembling the green state layup with one or more sub-assemblies; and processing the green state layup and the one or more sub-assemblies to form the composite component. In an exemplary embodiment, the composite component is a turbine nozzle airfoil. Another exemplary method comprises laying up a plurality of composite plies to form a composite ply layup; compacting the composite ply layup to form a green state layup; machining the green state layup; assembling the green state layup with one or more sub-assemblies; and processing the green state layup and the one or more sub-assemblies to form the composite component.

COMPOSITE INCLUDING A COMPONENT AND A GLASS MATERIAL

A composite includes a component and a glass or glass ceramic material. The component has a first coefficient of expansion .sub.1 and the glass or the glass ceramic material has a second coefficient of expansion .sub.2. The glass or the glass ceramic material has a surface with a thickness and thickness differences (TTV) within the surface, and thickness fluctuations (LTV). The composite has a residual stress in the glass or the glass ceramic material (WARP), and a geometric and material-physical degree of compatibility KG4.

EXTENDED LENGTH TUBE STRUCTURES
20180363811 · 2018-12-20 ·

An extended length tube structure includes a first ceramic tube segment having a first end and a second end, and a second ceramic tube segment having a first end and a second end, in which the second end of the first ceramic tube segment is arranged to face the first end of the second ceramic tube segment. A ceramic coupling component is positioned to circumscribe the end-to-end configuration of the tube segments, and is sinter-bonded to the tube segments to form a continuous, extended length tube structure having a seal, such as a sinter bond or an interference bond, that is free of bond materials.

Metal ceramic substrate and method for manufacturing such metal ceramic substrate

A carrier substrate (1) for electrical components, in particular metal-ceramic substrate (1) for electrical components, comprising an insulation layer (10), the insulation layer (10) preferably having a material comprising a ceramic or a composite comprising at least one ceramic layer, a component metallization (20) which is formed on a component side (BS) and has a first primary structuring (21), and a cooling part metallization (30) which is formed on a cooling side (KS) opposite the component side (BS) and has a second primary structuring (31), wherein the insulation layer (10), the component metallization (20) and the cooling part metallization (30) are arranged one above the other along a stacking direction (S), and
wherein the first primary structuring (21) and the second primary structuring (31), as viewed in the stacking direction (S), run congruently at least in portions.

CERAMIC/ALUMINUM JOINED BODY, INSULATING CIRCUIT BOARD, POWER MODULE, LED MODULE, AND THERMOELECTRIC MODULE
20180346387 · 2018-12-06 ·

A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.

Method for hydrophobicizing a zirconia surface

A method of treating a ceramic surface containing zirconia, whereby the ceramic surface is ablated by directing a laser beam with a diameter of 200-400 m produced by a CO.sub.2 laser with a pulse frequency of 1200-1800 Hz onto the ceramic surface, and a N.sub.2 assist gas is concurrently applied with a pressure of 550-650 KPa co-axially with the laser beam to form an ablated ceramic surface comprising microgrooves with ZrN present on a surface of the microgrooves, wherein the ablated ceramic surface has a higher surface hydrophobicity than the ceramic surface prior to the ablating.

Apparatus and method for improving adhesive strength of dental restoration
10125054 · 2018-11-13 ·

A method and apparatus for producing a dental restoration with enhanced adhesive or bonding strength are disclosed. The dental restoration comprises a zirconia based crown and a porcelain layer built-up on a top surface of the zirconia based crown. The zirconia based crown is to be bonded to a top of an abutment tooth and has dimensions that are smaller than outer dimensions of the abutment tooth. A first surface of the zirconia based crown is configured to adhere to the abutment tooth and a second surface of the zirconia based crown is configured to receive the porcelain layer built-up. The first surface and the second surface of the zirconia based crown are treated with a surface treatment solution which includes at least nitric acid (HNO.sub.3), hydrofluoric acid (HF) and hydrogen peroxide (H.sub.2O.sub.2). Further, the zirconia based crown may be treated with an ultrasonic impact treatment in addition to the surface treatment of the zirconia based crown.

COMPOSITE CONDUCIVE TO HEAT DISSIPATION OF LED-MOUNTED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

A composite conducive to heat dissipation of an LED-mounted substrate includes a ceramic layer being of a thermal conductivity of 2024 W/mK; a metal layer being of a thermal conductivity of 100200 W/mK; and a graphite layer being of an in-plane thermal conductivity of 950 W/mK and a through-plane thermal conductivity of 3 W/mK, wherein the metal layer is disposed between the ceramic layer and the graphite layer. The composite has one side displaying satisfactory insulation characteristics and the other side displaying satisfactory heat transfer characteristics. The composite incurs low material costs and requires a simple manufacturing process.

Ceramic-copper composite, ceramic circuit board, power module, and method of producing ceramic-copper composite

A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10?, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10?, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10?, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10?.