An oxidation protection system disposed on a substrate is provided, which may comprise a base layer comprising a first pre-slurry composition comprising a first phosphate glass composition, and/or a sealing layer comprising a second pre-slurry composition comprising a second phosphate glass composition and a strengthening compound comprising boron nitride, a metal oxide, and/or silicon carbide.

The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10.sup.−3 mbar.

In an X-ray diffraction diagram of a cordierite sintered body of the present invention, the ratio of the total of the maximum peak intensities of components other than cordierite components to the peak top intensity of the (110) plane of cordierite is 0.0025 or less. Since having a significantly small amount of different phases other than the cordierite components, this cordierite sintered body has a high surface flatness when the surface thereof is mirror-polished.

Electrical insulating properties between adjacent copper plates are improved while a defect of a bonded substrate which is caused by concentration of stress to end portions of the copper plates is prevented. A bonded substrate includes a silicon nitride ceramic substrate, a copper plate, and a bonding layer. The copper plate and the bonding layer are disposed on the silicon nitride ceramic substrate. The bonding layer bonds the copper plate to the silicon nitride ceramic substrate. The bonding layer includes: an interplate portion between the silicon nitride ceramic substrate and the copper plate; and a protruding portion protruding from between the silicon nitride ceramic substrate and the copper plate. Exposure of the silicon nitride ceramic substrate is prevented at a position where the protruding portion is disposed.

An epitaxy substrate and a method of manufacturing the same are provided. The epitaxy substrate includes a device substrate and a handle substrate. The device substrate has a first surface and a second surface opposite to each other, and a bevel disposed between the first and the second surfaces. The handle substrate is bonded to the second surface of the device substrate, wherein the oxygen content of the device substrate is less than the oxygen content of the handle substrate, and a bonding angle greater than 90° is between the bevel of the device substrate and the handle substrate.

A method for joining an optical part made of quartz glass and a supporting part made of ceramic includes forming a metal layer on a surface of the supporting part by electroless plating, polishing the formed metal layer with a polishing pad to form a first smoothed face on the supporting part surface, polishing a surface of the optical part with the polishing pad to form a second smoothed face, cleaning the first smoothed face and the second smoothed face with ultrasonic cleaning water, forming a first metal film on the first smoothed face by vapor deposition and forming a second metal film on the second smoothed face by vapor deposition, and joining the first metal film and the second metal film to each other by interatomic joining by atomic diffusion between the faces at which the first metal film and the second metal film contact with each other.

A method for preparing a ceramic copper clad laminate is provided, including following steps: providing a copper material; forming a copper oxide layer on a surface of the copper material; thermally treating the copper material on which the copper oxide layer is formed, to diffuse oxygen atoms in the copper material; removing the copper oxide layer on the thermally treated copper material; and soldering the copper-oxide-layer-removed copper material to a ceramic substrate to obtain a ceramic copper clad laminate.

The present disclosure is directed to a composite material comprising a thermoplastic adhesive and nanotubes oriented in the in-plane orientation. In additional aspects, the disclosure includes a laminated armor material comprising the composite and armor materials.

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135° to 165° on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110° to 145° a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 μm. The second main surface extends beyond the extended plane of the first portion by a distance of 10 μm or more.